Used AG ASSOCIATES Heatpulse 210T-03 #9242881 for sale

ID: 9242881
Vintage: 1985
Rapid thermal processor 1985 vintage.
AG ASSOCIATES Heatpulse 210T-03 is a powerful rapid thermal processor designed for advanced thermal processing operations. This unit offers a high speed, uniform heating rate that is adjustable to meet specific manufacturing requirements. The heating time and temperature can be precisely controlled with a tight temperature accuracy of ±2°C, making it the ideal choice for high-throughput thermal treatments. Heatpulse 210T-03 features a continuous operation mode of up to 1000°C maximum process temperature and 15W/cm^2 maximum power density, and is capable of reaching temperatures at a high speed of up to 20°C/second while maintaining a high level of uniformity and repeatability. This makes the unit capable of processing wafers up to 50mm diameter with an outstanding level of precision and repeatability. It also offers a hot-wall environment for ultra-high mechanical stability while processing. This thermal processor features a variety of flexible options to configure heating and cooling including a range of furnace-born accessories such as gas dosing, oxygen dosing, and adjustable tube blower that facilitate accurate control and greater flexibility. The unit also supports optional remote vision and imaging systems for automated quartz sensing and temperature control and storage of up to 256 recipes for future reference. In order to ensure long-term reliability and performance, AG ASSOCIATES Heatpulse 210T-03 is designed with an advanced convection cooling system, low oxide industrial heating elements, long-life chamber designs and protection against over temperature and power over current. It also comes standard with safety features such as emergency stop, over temperature limit and over-voltage protection. Overall, Heatpulse 210T-03 is an excellent choice for high-throughput operations offering cutting-edge technology, efficient thermal control accuracy, and a wide range of features that are sure to meet the most demanding thermal processing requirements.
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