Used AG ASSOCIATES Heatpulse 4108 #9146305 for sale
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ID: 9146305
Wafer Size: 5"-8"
Rapid thermal processor annealing system, 5"-8"
Electronics
Mass-flow-controlled gas handling
Cooling
ULPA filtration
Mechanical assemblies
Applications:
Silicon dielectric growth
Implant annealing
Glass re-flow
Silicide formation and annealing
Nitridation of metals
Contact alloying
Oxygen donor annihilation
Wafer handling: Automatic serial processing
Standard cassettes
Throughput: Process dependent
Ramp-up rate: Programmable
1 – 180°C Per second
Steady-state duration: 1 – 600 Seconds per step
Ramp-down rate: Programmable
1 – 180°C Per second
Ramp down rate is temperature
Radiation dependent
Maximum 150°C per second
Recommended steady-state temperature range: 400 – 1200°C
ERP Temperature accuracy:
+3°C to -7°C
Calibrated against an instrumented thermocouple wafer (ITC)
Temperature repeatability: + 3°C
Temperature uniformity: + 5°C.
AG ASSOCIATES Heatpulse 4108 is a state-of-the-art, rapid thermal processor designed to deliver precise thermal treatments. It is capable of heating an wafer array of up to eight wafers simultaneously, with a sub-second temperature rate for efficiency and accuracy. Heatpulse 4108 can provide for remarkable temperature stability on all eight wafers, with a thermal precision of ± 0.3 ° C. AG ASSOCIATES Heatpulse 4108 is specifically designed for fast wafer heating processes, enabling the user to complete a complete thermal treatment in as little as two minutes. It offers two zone control settings, allowing for dependable, uniform temperatures. It also features a precision furnace that heats the wafer evenly by taking into account the subsite temperature variation inherent in dense wafer arrays. Through its advanced controller, Heatpulse 4108 is capable of providing precisely-controlled, smooth temperature profiles. It utilizes an intuitive, easy-to-use user interface for simple programming and data acquisition. For applications requiring very rapid heating and cooling times, AG ASSOCIATES Heatpulse 4108 can process an entire wafer array in less than 350 microseconds. Heatpulse 4108 can be adapted to the different needs of many applications, including chemical vapor deposition (CVD), high-temperature annealing (HTA) and rapid thermal processing (RTP). It is ideally suited for thermal processing applications in optoelectronic, conventional and advanced semiconductor device manufacturing. This versatile and powerfulrapid thermal processor is highly cost-effective, offering user-friendly operation, precision temperature control, and fast thermal pprocessing. AG ASSOCIATES Heatpulse 4108 is a reliable and precise thermal processing tool, providing consistent results with high-quality, repeatable performance.
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