Used AG ASSOCIATES Heatpulse 4108 #9146377 for sale

Name: AG ASSOCIATES Heatpulse 4108
Brand: AG ASSOCIATES
SKU: 9146377
Availability: InStock

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Rapid Thermal Processors

Manufacturer

AG ASSOCIATES

Model

Heatpulse 4108

ID: 9146377

Wafer Size: 5"-8"

Rapid thermal processor annealing system, 5"-8" Includes: Process chamber: Two high-intensity tungsten halogen lamp arrays STD Bus for real-time operation Quartz isolation tube Robot / Robot controller Gas control electronics ULPA Filtration system Graphic user interface (GUI) computer system Electronics Mass-flow-controlled gas handling Cooling Mechanical assemblies Applications: Silicon dielectric growth Implant annealing Glass re-flow Silicide formation and annealing Nitridation of metals Contact alloying Oxygen donor annihilation Wafer handling: Automatic serial processing Standard cassettes Throughput: Process dependent Ramp-up rate: Programmable Range: 1 – 180°C Per second Steady-state duration: 1 – 600 Seconds per step Ramp-down rate: Programmable Temperature Radiation dependent Range: 1 – 180°C Per second Maximum: 150°C per second Recommended steady-state temperature range: 400 – 1200°C ERP Temperature accuracy: +5°C to -9°C Calibrated against an instrumented thermocouple wafer (ITC) Temperature repeatability: + 7°C Temperature uniformity: + 10°C.

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AG ASSOCIATES Heatpulse 4108 is a rapid thermal processor (RTP) with unmatched flexibility. The system utilizes a layer-by-layer technique, making it useful for many applications, including rapid prototyping, rapid thermal processing (RTP), rapid thermal annealing (RTA), rapid ALD (atomic layer deposition), rapid CVD (chemical vapor deposition), and diamond deposition. Heatpulse 4108 is designed with precise uniformity and contains thermal uniformity construction and software tools that enable highly accurate thermal processing of up to 4 layers in simultaneous operation. The sophisticated process chamber design with an advanced cooling plate ensures uniformity while maintaining excellent thermal stability. The heating element can be adjusted to allow for a range of temperatures between RTD (room temperature) and 1100 ˚C. The system also allows for precisely controlling the processing time, from 0.1 second to 999 minutes (or longer with an extended run option). AG ASSOCIATES Heatpulse 4108 also offers the highest degree of uniformity and high throughput. The patented uniformity correction software enables constant layer thickness adjustment during multiple runs without having to adjust the equipment. The process chamber is also equipped with an RF split-horn to prevent hotspot formation when processing small samples. Additionally, automated pneumatic wafer graspers enable safe and efficient system operation. Heatpulse 4108 can be equipped with a variety of additional components, including an undercut, UV-ozone cleaner, bulk gas inlet, and more. These enable specialized processes, such as CMP, non-oxidizing deep dielectric annealing, and more. AG ASSOCIATES Heatpulse 4108 can also be configured with a liquid nitrogen cooling chamber and effect chamber with nitrogen gas purge for enhanced process repeatability. Overall, Heatpulse 4108 is an advanced, highly customizable rapid thermal processor that is suitable for a wide variety of industrial, academic, and research applications. Its sophisticated design, flexible configuration, and excellent thermal stability make it one of the most versatile RTPs available on the market.