Used ALLWIN21 7400-0082-01-4D #9124968 for sale

ID: 9124968
Wafer Size: 3"-6"
Quartz wafer tray, 3"-6".
ALLWIN21 7400-0082-01-4D is an advanced rapid thermal processor that utilizes innovative heating and cooling technologies to quickly and precisely heat and cool wafer surfaces to optimize various semiconductor processes. This equipment is able to quickly heat the wafer surface to temperatures of up to 1000°C and then rapidly cool it down in order to create an ultra-high vacuum environment suitable for aligning and bonding device components. ALLWIN21 platform is designed with an advanced heat transfer system which features non-contact technology to quickly and precisely distribute heat across a substrate. The unit utilizes a three stage Iron-Gain-Flux technology to ensure rapid and consistent heating of the surface. Advanced rapid thermal process monitoring systems are also incorporated into the platform to monitor process parameters and provide real-time feedback to the user. In addition to the advanced heating and cooling elements, 7400-0082-01-4D features a three-zone vacuum chamber which is optimized for the deposition and annealing of various metals and other materials. Additionally, the machine offers a range of advanced features such as advanced wafer mapping, robotic transport of wafers, and integrated safety systems. ALLWIN21 7400-0082-01-4D tool is designed to provide reliable performance and superior results for a wide range of applications ranging from packaging to MEMS devices. The asset is compatible with the company's standard annealing and deposition modules, allowing users to customize the model to suit their specific application requirements. Furthermore, the equipment is designed to deliver consistent performance and precise temperature control in a variety of thermal processes. 7400-0082-01-4D rapid thermal processor is a highly capable system that provides excellent results and reliable performance at an affordable price. This unit is ideal for anyone who requires precise temperature control and reliable performance for a variety of thermal processing applications.
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