Used ALLWIN21 AW 903e #9201808 for sale
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ID: 9201808
Wafer Size: 3"-6"
Plasma etcher, 3"-6"
Wafer loading: 3-Axis robot
Stationary cassette plate
Plasma power: RF 13.56 MHz
Type: Parallel / Single wafer process
Stand alone
Gas lines: 1-3 Lines
Throughput: 30-60 WPH, Process dependent
Temperature: 6-65ºC (±2 ºC) Capability
Gas Lines: (4) Gas lines with MFCs
Etcher rate:
AW-901eR: 0-8000A / minute
AW-903eR: 0-4000A / minute
Process dependent
Uniformity: Up to ±3%, Process dependent
Particulate: <0.05 / cm2
Selectivity:
901eR: 2-20:1
AW-903eR: 2-20:1
Process dependent
MTBF / MTTA / MTTR: 450 Hours / 100 Hours / 3.5 Hours
Options:
EOP Module with PCB
GEM/SECS II Function
Lamp tower alarm with buzzer
Throttle valve pressure control
Vacuum pump
Chiller for chuck and chamber
Through the wall
Main frame, standard
Pentium class PC with
Keyboard
Mouse
USB
SW Backup
Cables
Chuck:3"-6"
Wafer aligner / Cooling station
3-Axis integrated solid robot:
H-Zero (Standard)
H1-7 x 10.5 (TTW)
Fixed cassette station:
Chuck assembly
901eR Non-anodized
903eR Anodized with flat
903eR Anodized with flat
903eR Non-anodized with flat
Reactor Assembly:
901eR Non-anodized
903eR Anodized
903eR Non-anodized
903eR High performance
Direct cooling
Non direct cooling
Pins:
Quartz
Ceramic SST
Centering ring:
Aluminum
Ceramic
Main control board:
Gas box with (4) inline gas lines, MFC, filters, and pneumatic valves
RF Matching network with PCB
RF Generator: 13.56 MHz
MKS Elite: 300 HD
MKS Elite: 600 HD
MKS Elite: 1000 HD
ENI ACG 3
ENI ACG 10
AC / DC Box
ATM Sensor
UPC Pressure control
225 SCCM: 901eR
2000 SCCM: 903eR
MKS Baratron with peumatic Iiolation valve
Main vacuum valves
Front EMO interlocks
Touch screen GU, 15"
AW-901eR AW-903eR
Material Etched Polysilicon / Nitride Oxide,SOG,Nitride
Main etchant gases SG6, O2 / SF6,O2 CHF3,SF6,He
Other gases CHCLF2 / None None
Pressure (mTorr) 200-450 / 250-350 1600-3000
RF Power (Watts) 100-250 / 200-300 400-600
Temperature (C) 30 / 30 23
AC Power:
AC Module: 200-240 VAC Selectable, 50/60 Hz, 3-wire single-phase
Temperature controller: 200-240 VAC, 50/60 Hz, 3-wire single-phase
Vacuum pump: 208-230 / 460 VAC, 60 Hz or 200-220 / 380 VAC, 50Hz, 3 Phase
RF Generator: 200-240 VAC
PC / Monitor: 115 VAC
Cabinet exhaust: 100 cfm.
ALLWIN21 AW 903e Rapid Thermal Processor (RTP) is a highly advanced semiconductor device test and packaging equipment. It is capable of extremely high speeds and offers superior efficiency when compared to other thermal processing systems. AW 903e is a multi-stage thermal processing system that includes a furnace with an advanced temperature control unit, an LED die temperature management (DTM) module, and a pressure sensor for accurate discrimination of surface oxides. The RTP furnace is designed to generate a uniform temperature inside the processing chamber to ensure accurate results. It can be programmed to reach high temperatures quickly and can reduce cycle times by as much as 90%. The advanced temperature control machine allows the exact temperature of the furnace to be set via a touch panel feature. This advanced temperature control ensures consistent performance. The LED die temperature management module ensures that each die within the wafer is heated to the desired temperature. This ensures the uniformity of the results achieved. It also improves throughput by reducing the wait time between wafers. The pressure sensor is used to detect surface oxides which can affect the accuracy of results. By detecting these surface oxides, ALLWIN21 AW 903e can eliminate the formation of them. This ensures the accuracy of results is not affected. AW 903e has also been designed with flexibility in mind. It can incorporate additional modules such as Wafer Heating Tool and Wafer Mapping Asset for additional accuracy. It is fully automated and has been designed with safety and maintenance in mind, making it a very efficient device. ALLWIN21 AW 903e is a highly advanced RTP and has been designed to provide the highest level of accuracy and throughput when processing wafers. Its uniform temperature and advanced DTM ensures uniform performance, and its ability to integrate other modules for additional accuracy and efficiency make it ideal for many applications. It is efficient, safe to maintain and operate, and is easily integrated with existing systems.
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