Used AMAT / APPLIED MATERIALS Vantage Radiance #293587166 for sale
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ID: 293587166
Rapid Thermal Processing (RTP) system, 12"
Process: RadOx
(2) Chambers
Wafer type: SNNF
Platform type: Vantage 3.X
Position A and B: (V352) RadOx2
Chamber A and B process: Toxic RP
OHT WIP Delivery
Dual 2-slot active cool down station
E99 Docked reading capability
Load port: SELOP 7
Load port operator interface: Standard (8) lights
Configurable colored lights
Top air intake system
Upper E84 interface enabled OHT
Upper E84 PIO sensors and cables
E99 Carrier ID: TIRIS With RF
Operator access switch
4-Color configurable light towers
Interface A option
eDiagnostic
Out the back connection type: RP
Out the back connection H2
(2) Water cooling chambers
RP Integration hardware: Chamber A and B
Standard RAGB rear light tower
Vantage skin: (2) Toxic chambers
IPUP Transfer pump
Open loop tuner
MFC Type: STEC
Core anneal and RTO
Monitor 1: Flat panel with keyboard on stand, 17"
Monitor 2: Flat panel on stand, 17"
Monitor 1 and 2 cables: 25 ft with 16 feet effective
SEMI F47
Semi S2 compliance
RTP Chamber type: Radiance RadOx2, 12"
Technology option: Open loop tuner
MFC Type: STEC
Core anneal and RTO
Rotation type: WRLD Toxic
Low flow O2: 5 SLM
High flow O2: 50 SLM
Oxygen analyzer
H2:
High flow
Low flow
Side inject
No process N2 for flammable MNFLD
Gas pallet type: TOXIC RP Common gas pallet
No MWBC improvement kit
Chamber integration lines: RadOx2
RP Pump cable: 81 Feet
Base ring: RadOx2 base ring
Line 1 / N2 (N/O), 50 SLM
Line 2 / O2, 50 SLM
Line 3 / O2, 5 SLM
Line 6 / H2, 15 SLM, Side inject high flow
Line 7 / H2, 22 SLM, High flow
Line 8 / H2, 2 SLM, Low flow
Line 10 / N2 (P/P), 30 SLM Restrictor
Line 11 / He, 30 SLM
Line 12 / N2 (BP), 50 SLM
Line 13 / N2 (Maglev), 100 SLM
Docking station FST install kit
Does not include Hard Disk Drive (HDD)
2017 vintage.
AMAT / APPLIED MATERIALS Vantage Radiance is a high-performance, advanced rapid thermal processor that applies innovative technologies to improve process stability, enable high-temperature transitions, and maximize the quality of chip manufacturing while significantly reducing process times. AMAT Vantage Radiance has the capability of achieving high-temperature transitions up to 2000°C, in a matter of seconds. This extremely high-performanceRTP also allows for precise temperature control. APPLIED MATERIALS Vantage Radiance has an improved temperature uniformity across the heated area and a faster transient thermal response time. It also offers a wide operating window, allowing for a larger process temperature range, thus providing process flexibility. Vantage Radiance features an efficient process control that enables the equipment to monitor the temperature distribution, with adjustable time and temperature safety margins for enhanced system control. Its automation capabilities help reduce cycle time, improve repeatability, and simplify unit setup and control. Its innovative radiative heating and convective cooling abilities help maintain a uniform temperature distribution with a high degree of temporal stability. This helps to improve thermal stability and reduce the likelihood of temperature fluctuations due to thermal shock. The multi-zone temperature control and full automation capabilities of AMAT / APPLIED MATERIALS Vantage Radiance help to maintain the highest level of quality and consistency in the process. This machine also integrates a variety of advanced safety features, ensuring the safety of personnel and devices. With its innovative technologies, AMAT Vantage Radiance accurately and quickly processes at temperatures required in modern IC manufacturing, helping to reduce cycle times while maintaining process quality. Overall, APPLIED MATERIALS Vantage Radiance is a high-performance and advanced rapid thermal processor, featuring innovative heating technologies, comprehensive automation capabilities, and advanced safety features. It is designed to provide a high degree of temperature uniformity and stability while helping to maximize the quality and efficiency of chip manufacturing.
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