Used AMAT / APPLIED MATERIALS Vantage Radiance #293587171 for sale

ID: 293587171
Rapid Thermal Processing (RTP) system, 12" Process: RadOx (2) Chambers Wafer type: SNNF Platform type: Vantage 3.X Position A and B: (V352) RadOx2 Chamber A and B process: Toxic RP OHT WIP Delivery Dual 2-slot active cool down station No remote control system E99 Docked reading capability Load port: SELOP 7 Load port operator interface: Standard (8) lights Configurable colored lights Top air intake system Upper E84 interface enabled OHT Upper E84 PIO sensors and cables E99 Carrier ID: TIRIS With RF Operator access switch 4-Color configurable light towers Interface A option eDiagnostic Out the back connection type: RP Out the back connection H2 (2) Water cooling chambers RP Integration hardware: Chamber A and B Standard RAGB rear light tower Vantage skin: (2) Toxic chambers IPUP Transfer pump Open loop tuner MFC Type: STEC Core anneal and RTO Monitor 1: Flat panel with keyboard on stand, 17" Monitor 2: Flat panel on stand, 17" Monitor 1 and 2 cables: 25 ft with 16 feet effective SEMI F47 Semi S2 compliance RTP Chamber type: Radiance RadOx2, 12" Technology option: Open loop tuner MFC Type: STEC Core anneal and RTO Rotation type: WRLD Toxic Low flow O2: 5 SLM High flow O2: 50 SLM Oxygen analyzer H2: High flow Low flow Side inject No process N2 for flammable MNFLD Gas pallet type: TOXIC RP Common gas pallet No MWBC improvement kit Chamber integration lines: RadOx2 RP Pump cable: 81 Feet Base ring: RadOx2 base ring Line 1 / N2 (N/O), 50 SLM Line 2 / O2, 50 SLM Line 3 / O2, 5 SLM Line 6 / H2, 15 SLM, Side inject high flow Line 7 / H2, 22 SLM, High flow Line 8 / H2, 2 SLM, Low flow Line 10 / N2 (P/P), 30 SLM Restrictor Line 11 / He, 30 SLM Line 12 / N2 (BP), 50 SLM Line 13 / N2 (Maglev), 100 SLM Docking station FST install kit Does not include Hard Disk Drive (HDD) 2016 vintage.
AMAT / APPLIED MATERIALS Vantage Radiance is a rapid thermal processor that operates in a vacuum environment to efficiently process wafers for semiconductor device fabrication. The equipment uses advanced technology that enables temperature values to be precisely controlled during the rapid thermal processes. In addition, the system can convert materials to altered forms, including amorphous, polycrystalline, and single-crystal structures, as well as multi-layer structures. This can also be used to improve layer uniformity and microstructural properties. The main components of the Radiance unit include a loadlock chamber, a flash lamp, and a high vacuum frame. The loadlock chamber is the main area of the machine where the wafers are loaded and unloaded. The flash lamp is used to heat up the interior of the chamber, while the high vacuum frame maintains the vacuum environment. In addition, the tool includes advanced process control modules, which are used to monitor the temperature, pressure and other parameters during the rapid thermal processing. The asset has a maximum processing temperature of 1000 °C and can process up to 12 wafers in a single cycle. This allows for increased productivity and a faster cycle time. The model also features an industry standard wafer-handling equipment, with an automatic cassette-to-cassette transfer station, and automated alignment detection. This makes it easy to setup, operate, and maintain the system and results in improved reliability and performance. The Radiance unit uses advanced control technologies to ensure accuracy and repeatable results during each rapid thermal process. It includes a built-in feedback loop between the wafer temperature and the flash lamp intensity, allowing the machine to maintain a constant and consistent temperature across the entire surface of the wafer. This ensures consistent thermal processing results. In addition, the tool has a built in pressure monitoring asset that allows for an overall precision control. The Radiance model not only has the ability to rapidly convert materials to altered forms, but can also be used to rapidly anneal materials. This process can be used to reduce the crystalline defects, increase the contact resistance, and enhance the dopant activation within the desired depth of the material. Thus, the Radiance equipment is an excellent choice for semiconductor device manufacturers, due to its flexibility, accuracy, and reliability.
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