Used AMAT / APPLIED MATERIALS Vantage Radiance #293587171 for sale
URL successfully copied!
Tap to zoom
ID: 293587171
Rapid Thermal Processing (RTP) system, 12"
Process: RadOx
(2) Chambers
Wafer type: SNNF
Platform type: Vantage 3.X
Position A and B: (V352) RadOx2
Chamber A and B process: Toxic RP
OHT WIP Delivery
Dual 2-slot active cool down station
No remote control system
E99 Docked reading capability
Load port: SELOP 7
Load port operator interface: Standard (8) lights
Configurable colored lights
Top air intake system
Upper E84 interface enabled OHT
Upper E84 PIO sensors and cables
E99 Carrier ID: TIRIS With RF
Operator access switch
4-Color configurable light towers
Interface A option
eDiagnostic
Out the back connection type: RP
Out the back connection H2
(2) Water cooling chambers
RP Integration hardware: Chamber A and B
Standard RAGB rear light tower
Vantage skin: (2) Toxic chambers
IPUP Transfer pump
Open loop tuner
MFC Type: STEC
Core anneal and RTO
Monitor 1: Flat panel with keyboard on stand, 17"
Monitor 2: Flat panel on stand, 17"
Monitor 1 and 2 cables: 25 ft with 16 feet effective
SEMI F47
Semi S2 compliance
RTP Chamber type: Radiance RadOx2, 12"
Technology option: Open loop tuner
MFC Type: STEC
Core anneal and RTO
Rotation type: WRLD Toxic
Low flow O2: 5 SLM
High flow O2: 50 SLM
Oxygen analyzer
H2:
High flow
Low flow
Side inject
No process N2 for flammable MNFLD
Gas pallet type: TOXIC RP Common gas pallet
No MWBC improvement kit
Chamber integration lines: RadOx2
RP Pump cable: 81 Feet
Base ring: RadOx2 base ring
Line 1 / N2 (N/O), 50 SLM
Line 2 / O2, 50 SLM
Line 3 / O2, 5 SLM
Line 6 / H2, 15 SLM, Side inject high flow
Line 7 / H2, 22 SLM, High flow
Line 8 / H2, 2 SLM, Low flow
Line 10 / N2 (P/P), 30 SLM Restrictor
Line 11 / He, 30 SLM
Line 12 / N2 (BP), 50 SLM
Line 13 / N2 (Maglev), 100 SLM
Docking station FST install kit
Does not include Hard Disk Drive (HDD)
2016 vintage.
AMAT / APPLIED MATERIALS Vantage Radiance is a rapid thermal processor that operates in a vacuum environment to efficiently process wafers for semiconductor device fabrication. The equipment uses advanced technology that enables temperature values to be precisely controlled during the rapid thermal processes. In addition, the system can convert materials to altered forms, including amorphous, polycrystalline, and single-crystal structures, as well as multi-layer structures. This can also be used to improve layer uniformity and microstructural properties. The main components of the Radiance unit include a loadlock chamber, a flash lamp, and a high vacuum frame. The loadlock chamber is the main area of the machine where the wafers are loaded and unloaded. The flash lamp is used to heat up the interior of the chamber, while the high vacuum frame maintains the vacuum environment. In addition, the tool includes advanced process control modules, which are used to monitor the temperature, pressure and other parameters during the rapid thermal processing. The asset has a maximum processing temperature of 1000 °C and can process up to 12 wafers in a single cycle. This allows for increased productivity and a faster cycle time. The model also features an industry standard wafer-handling equipment, with an automatic cassette-to-cassette transfer station, and automated alignment detection. This makes it easy to setup, operate, and maintain the system and results in improved reliability and performance. The Radiance unit uses advanced control technologies to ensure accuracy and repeatable results during each rapid thermal process. It includes a built-in feedback loop between the wafer temperature and the flash lamp intensity, allowing the machine to maintain a constant and consistent temperature across the entire surface of the wafer. This ensures consistent thermal processing results. In addition, the tool has a built in pressure monitoring asset that allows for an overall precision control. The Radiance model not only has the ability to rapidly convert materials to altered forms, but can also be used to rapidly anneal materials. This process can be used to reduce the crystalline defects, increase the contact resistance, and enhance the dopant activation within the desired depth of the material. Thus, the Radiance equipment is an excellent choice for semiconductor device manufacturers, due to its flexibility, accuracy, and reliability.
There are no reviews yet