Used AMAT / APPLIED MATERIALS Vantage Radiance #293587172 for sale
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ID: 293587172
Rapid Thermal Processing (RTP) system, 12"
Process: RadOx
(2) Chambers
Wafer type: SNNF
Platform type: Vantage 3.X
Position A and B: (V352) RadOx2
Chamber A and B process: Toxic RP
OHT WIP Delivery
Dual 2-slot active cool down station
No remote control system
E99 Docked reading capability
Load port: SELOP 7
Load port operator interface: Standard (8) lights
Configurable colored lights
Top air intake system
Upper E84 interface enabled OHT
Upper E84 PIO sensors and cables
E99 Carrier ID: TIRIS With RF
Operator access switch
4-Color configurable light towers
Interface A option
eDiagnostic
Out the back connection type: RP
Out the back connection H2
(2) Water cooling chambers
RP Integration hardware: Chamber A and B
Standard RAGB rear light tower
Vantage skin: (2) Toxic chambers
IPUP Transfer pump
Open loop tuner
MFC Type: STEC
Core anneal and RTO
Monitor 1: Flat panel with keyboard on stand, 17"
Monitor 2: Flat panel on stand, 17"
Monitor 1 and 2 cables: 25 ft with 16 feet effective
SEMI F47
Semi S2 compliance
RTP Chamber type: Radiance RadOx2, 12"
Technology option: Open loop tuner
MFC Type: STEC
Core anneal and RTO
Rotation type: WRLD Toxic
Low flow O2: 5 SLM
High flow O2: 50 SLM
Oxygen analyzer
H2:
High flow
Low flow
Side inject
No process N2 for flammable MNFLD
Gas pallet type: TOXIC RP Common gas pallet
No MWBC improvement kit
Chamber integration lines: RadOx2
RP Pump cable: 81 Feet
Base ring: RadOx2 base ring
Line 1 / N2 (N/O), 50 SLM
Line 2 / O2, 50 SLM
Line 3 / O2, 5 SLM
Line 6 / H2, 15 SLM, Side inject high flow
Line 7 / H2, 22 SLM, High flow
Line 8 / H2, 2 SLM, Low flow
Line 10 / N2 (P/P), 30 SLM Restrictor
Line 11 / He, 30 SLM
Line 12 / N2 (BP), 50 SLM
Line 13 / N2 (Maglev), 100 SLM
Docking station FST install kit
Does not include Hard Disk Drive (HDD)
2016 vintage.
AMAT / APPLIED MATERIALS Vantage Radiance is a rapid thermal processor that is designed to quickly and efficiently heat wafers during semiconductor manufacturing processes. It is one of the most advanced thermal processing systems on the market, offering a number of features and benefits for chip makers. AMAT Vantage Radiance features a high-power, rapid-thermal processing furnace that has been designed to transmit uniform heat, with a maximum temperature range of up to 1300°C. This is accompanied by a quick ramp time of less than 0.1 second per step, allowing it to achieve temperature set points quickly and accurately. This helps reduce the long wafer cycle time, enabling chip makers to make more advanced semiconductor devices. APPLIED MATERIALS Vantage Radiance is also equipped with an Advanced Control Equipment, allowing operators to manage and control the various processes and conditions necessary for thermal processing. This includes a variety of tools to monitor conditions such as temperature, pressure, gas flow, and wafer surface conditions. This system also allows for the calibration of the furnace's cooking parameters to ensure optimal performance from each batch of wafers. In addition, Vantage Radiance utilizes a patented Multiple Process Control Unit (MPCS), which can run simultaneous processes for multiple wafers. This allows for rapid and simultaneous heating of multiple wafers, without compromising the accuracy and control of the thermal processes. The MPCS also features thermal recipes for different process steps, for quickly producing consistent results. Overall, AMAT / APPLIED MATERIALS Vantage Radiance is an advanced rapid thermal processer designed to increase the efficiency and performance of semiconductor manufacturing. With its high-power furnace, Advanced Control Machine, and Multiple Process Control Tool, AMAT Vantage Radiance is capable of quickly and accurately fulfilling a variety of thermal processing needs.
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