Used AMAT / APPLIED MATERIALS Vantage Radiance #293587174 for sale
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ID: 293587174
Rapid Thermal Processing (RTP) system, 12"
Process: RadOx
(2) Chambers
Wafer type: SNNF
Platform type: Vantage 3.X
Position A and B: (V352) RadOx2
Chamber A and B process: Toxic RP
OHT WIP Delivery
Dual 2-slot active cool down station
No remote control system
E99 Docked reading capability
Load port: SELOP 7
Load port operator interface: Standard (8) lights
Configurable colored lights
Top air intake system
Upper E84 interface enabled OHT
Upper E84 PIO sensors and cables
E99 Carrier ID: TIRIS With RF
Operator access switch
4-Color configurable light towers
Interface A option
eDiagnostic
Out the back connection type: RP
Out the back connection H2
(2) Water cooling chambers
RP Integration hardware: Chamber A and B
Standard RAGB rear light tower
Vantage skin: (2) Toxic chambers
IPUP Transfer pump
Open loop tuner
MFC Type: STEC
Core anneal and RTO
Monitor 1: Flat panel with keyboard on stand, 17"
Monitor 2: Flat panel on stand, 17"
Monitor 1 and 2 cables: 25 ft with 16 feet effective
SEMI F47
Semi S2 compliance
RTP Chamber type: Radiance RadOx2, 12"
Technology option: Open loop tuner
MFC Type: STEC
Core anneal and RTO
Rotation type: WRLD Toxic
Low flow O2: 5 SLM
High flow O2: 50 SLM
Oxygen analyzer
H2:
High flow
Low flow
Side inject
No process N2 for flammable MNFLD
Gas pallet type: TOXIC RP Common gas pallet
No MWBC improvement kit
Chamber integration lines: RadOx2
RP Pump cable: 81 Feet
Base ring: RadOx2 base ring
Line 1 / N2 (N/O), 50 SLM
Line 2 / O2, 50 SLM
Line 3 / O2, 5 SLM
Line 6 / H2, 15 SLM, Side inject high flow
Line 7 / H2, 22 SLM, High flow
Line 8 / H2, 2 SLM, Low flow
Line 10 / N2 (P/P), 30 SLM Restrictor
Line 11 / He, 30 SLM
Line 12 / N2 (BP), 50 SLM
Line 13 / N2 (Maglev), 100 SLM
Docking station FST install kit
Does not include Hard Disk Drive (HDD)
2016 vintage.
AMAT / APPLIED MATERIALS Vantage Radiance is a rapid thermal processor designed to create reliable and repeatable wafer temperature profiles to facilitate high-precision semiconductor fabrication processes. It is a compact, precision heat processing unit with a two-zone process chamber capable of reaching up to 120˚C. The Radiance offers a dynamic temperature range of up to 600˚C, with an accuracy of +/- 5˚C. This allows for very accurate and repeatable thermal annealing processes. The Radiance is equipped with an ultra clean process chamber and an electrostatic chuck table, to help maintain a clean and static-free environment. The Radiance also features built-in thermal conductivity and uniformity measurement tools. This ensures accurate and repeatable results, resulting in better wafer yields and quality. The Radiance also includes a state-of-the-art High Speed Power Controller (HSPC). The HSPC is comprised of a multi-stage pulse width modulation (PWM) system and an intelligent controller, allowing for complex power management. The HSPC is capable of managing up to 30 STPV (Step Time Process Variable) to achieve optimal thermal annealing conditions. The Radiance has been designed to enable a flexible and high-speed thermal process. It features fast heating and cooling rates, accurate and repeatable thermal profiles and short cycle times, enabling fabrication of fine line lithography and complex etch profiles. Additionally, it can be equipped with a high-resolution pyrometer to monitor process conditions in real-time and ensure optimal performance. The Radiance is sold as a ready-to-use system, fully tested and configurable. The system is designed to automate the process, while maintaining a high degree of accuracy and repeatability. The Radiance is available as a configurable stand-alone unit or as part of a comprehensive suite of tools. With its combination of automation, accuracy, repeatability and flexibility, the Radiance is a powerful choice for semiconductor fabrication.
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