Used AMAT / APPLIED MATERIALS Vantage Radiance #293587176 for sale
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ID: 293587176
Rapid Thermal Processing (RTP) system, 12"
Process: RadOx
(2) Chambers
Wafer type: SNNF
Platform type: Vantage 3.X
Position A and B: (V352) RadOx2
Chamber A and B process: Toxic RP
OHT WIP Delivery
Dual 2-slot active cool down station
No remote control system
E99 Docked reading capability
Load port: SELOP 7
Load port operator interface: Standard (8) lights
Configurable colored lights
Top air intake system
Upper E84 interface enabled OHT
Upper E84 PIO sensors and cables
E99 Carrier ID: TIRIS With RF
Operator access switch
4-Color configurable light towers
Interface A option
eDiagnostic
Out the back connection type: RP
Out the back connection H2
(2) Water cooling chambers
RP Integration hardware: Chamber A and B
Standard RAGB rear light tower
Vantage skin: (2) Toxic chambers
IPUP Transfer pump
Open loop tuner
MFC Type: STEC
Core anneal and RTO
Monitor 1: Flat panel with keyboard on stand, 17"
Monitor 2: Flat panel on stand, 17"
Monitor 1 and 2 cables: 25 ft with 16 feet effective
SEMI F47
Semi S2 compliance
RTP Chamber type: Radiance RadOx2, 12"
Technology option: Open loop tuner
MFC Type: STEC
Core anneal and RTO
Rotation type: WRLD Toxic
Low flow O2: 5 SLM
High flow O2: 50 SLM
Oxygen analyzer
H2:
High flow
Low flow
Side inject
No process N2 for flammable MNFLD
Gas pallet type: TOXIC RP Common gas pallet
No MWBC improvement kit
Chamber integration lines: RadOx2
RP Pump cable: 81 Feet
Base ring: RadOx2 base ring
Line 1 / N2 (N/O), 50 SLM
Line 2 / O2, 50 SLM
Line 3 / O2, 5 SLM
Line 6 / H2, 15 SLM, Side inject high flow
Line 7 / H2, 22 SLM, High flow
Line 8 / H2, 2 SLM, Low flow
Line 10 / N2 (P/P), 30 SLM Restrictor
Line 11 / He, 30 SLM
Line 12 / N2 (BP), 50 SLM
Line 13 / N2 (Maglev), 100 SLM
Docking station FST install kit
Does not include Hard Disk Drive (HDD)
2017 vintage.
AMAT / APPLIED MATERIALS Vantage Radiance is a Rapid Thermal Processor specifically designed for advanced semiconductor device manufacturing applications. It is a single wafer, batch-type Rapid Thermal Processor (RTP) that features a patented, stationary quartz walled-in-heater design with a highly efficient direct-conveyed, flat-panel design for maximum throughput. The station wall is composed of quartz and other non-flammable materials to ensure that the chamber is kept cool during rapid thermal processing. AMAT Vantage Radiance Rapid Thermal Processor employs multiple levels of thermal control to ensure the batch of wafers are uniformly processed. The temperature is controlled by an advanced thermal controller program utilizing a host to promote feedback and a multi-stage controller based on a high-accuracy thermocouple array and high-rate PID control. This equipment allows the device to be operated over a wide range of temperatures and pressures, allowing the user to fine-tune processing parameters as needed. The heating rate of the device can also be regulated by an adjustable ramp-up rate allowing the user to adjust the heat-up time. APPLIED MATERIALS Vantage Radiance Rapid Thermal Processor is designed with a multi-zone, full wafer coverage uniformity (MZ-FWCU) system that provides homogeneous heating over the entire wafer surface. The heated zone of the device is divided into three pseudo-isothermal processing regions (including a pre- and post-cooling zone) that can heat the wafer from room temperature to the highest set point temperature within an acceptable range. The MZ-FWCU ensures that the wafers are uniformly heated without any hot or cold spots. The chamber of Vantage Radiance is designed to remain extremely clean during processing times. The unit features a patented plasma generator that provides a stable and consistent cleaning environment, effectively eliminating any inter-particle debris and allowing for minimal surface and material damage. Additionally, the device is equipped with corrosion and particle-reduction features, a face-lift-grip mechanism, and adjustable heater heights to allow for quick and easy maintenance. Overall, AMAT / APPLIED MATERIALS Vantage Radiance Rapid Thermal Processor is an advanced and highly efficient single wafer processing machine that is designed to optimize device yields and minimize throughput time. Its capabilities and features, including the advanced thermal controller program, uniformity tool, and plasma generator make it an ideal choice for advanced semiconductor device manufacturing applications.
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