Used AMAT / APPLIED MATERIALS VANTAGE RADOX #9211114 for sale
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ID: 9211114
Wafer Size: 12"
Vintage: 2007
Rapid thermal processing system, 12"
Dual arm track robot edge grip
Control system features:
32-bit Micrprocessor control
Process parameter / Wafer history storage
Self diagnostics
Automated service routines / Host computer interface
Factory interface with (2) load ports, wafer mapping capability
System EMO with turn-to-release button
System water leak and smoke detectors
OHT WIP Delivery
Docked E99 reading capability
Enhanced 25 wafer FOUP
Docking flange shield
Upper E84 interface enabled OHT
Upper E84 sensors and cables
Hermos with RF E99 carrier ID
Operator access switch
Light curtain
4 Color configurable light tower (Front and rear)
LOTO Capability to lock out:
CDA to all slit valves
ISO Valves
Pneumatic doors
All gas / Liquid final valves
Heater power
(2) Operator interface CRT monitors:
Bay side (Through the wall flat panel with keyboard)
Plenum side (Flat panel with keyboard on stand & 25ft cable)
Diagnostic
Lamp head pump (RadOx chamber only)
Chamber pump (RadOx chamber only)
Lateral grain edge ring
Position A RTP radiance plus ATM vantage (V350):
Chamber A gas panel:
Gas MFC Size
N/O N2 50SLM
Hi O2 50SLM
Lo O2 5SLM
He 30SLM
N2 50SLM
N2 1sccm
N2 100SLM
H2 20SLM
H2 1SLM
Chamber B gas panel
Gas MFC Size
N/O N2 50SLM
Hi O2 50SLM
Lo O2 5SLM
He 30SLM
N2 50SLM
N2 1sccm
N2 100SLM
H2 20SLM
H2 1SLM
2007 vintage.
AMAT / APPLIED MATERIALS VANTAGE RADOX is an advanced rapid thermal processor (RTP) designed specifically for the semiconductor industry. This equipment offers high-speed thermal processing of wafers at low temperatures, precisely controlling wafer temperature as required. AMAT VANTAGE RADOX equipment is a compact, self-contained unit featuring a one-box design that allows for easy operation and maintenance. APPLIED MATERIALS VANTAGE RADOX features a large horizontal furnace chamber, allowing for maximum clearance of the substrate. This provides ample room for processing multiple wafers in parallel, with a high degree of accuracy. The system's precision temperature controls are highly reliable and repeatable, with a temperature range of -150°C to 400°C. It has a powerful furnace wind speed of up to 40 m/s, and a high heat flux of up to 1000 W/cm^2 to provide a rapid thermal ramp-up and stabilization. The unit is designed with a medium-low vacuum level to reduce wafer oxidation and enable high-quality thermal processing results. In addition, VANTAGE RADOX machine provides an integrated gas delivery tool with an array of gas supply options that can be tailored to the specific needs of the application. This unique feature allows for control of the gas environment and its delivery during the thermal process. There is also an advanced gas safety asset built-in for maximum user protection. The model can support a range of wafers sizes, from the most common 200-mm and 150-mm wafers all the way up to 450-mm wafers. This versatility facilitates thermal processing of any process and is an ideal solution for applications such as high-heat annealing, oxide dielectric deposition, and other advanced materials treatments. AMAT / APPLIED MATERIALS VANTAGE RADOX is an advanced piece of equipment designed to meet the needs of the modern semiconductor industry. It provides precise, quick and safe thermal processing capabilities with its enhanced temperature, gas, and furnace control options. Its finely tuned gas delivery, adaptable wafer handling, and advanced safety equipment all serve to foster maximum processing quality, while also ensuring operator safety.
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