Used AMAT / APPLIED MATERIALS Vantage Vulcan #9390649 for sale
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AMAT / APPLIED MATERIALS Vantage Vulcan is a rapid thermal processor (RTP) that delivers fast and accurate results for a variety of semiconductor applications. This equipment is designed for high throughput and accuracy in a compact form factor, making it an efficient and cost-effective solution for substrate processing needs. With a 300mm design, this RTP can provide pulse annealing and spike annealing of the wafer substrates at speeds much faster than traditional methods. AMAT Vantage Vulcan performs rapid thermal processing (RTP) to optimize flow and production of wafers and other substrates. This system uses powerful heating and cooling to rapidly heat and cool substrates at speeds up to 1250°C/sec. The Submerged Arc Heating (SAH) in the Vulcan allows for precise and repeatable processing. This SAH also provides a high degree of homogeneity, meaning that the heat is evenly distributed and reaches an exact target temperature in a consistent and efficient manner. Additionally, the unit is compact, with minimal waste and allows uniform process uniformity. APPLIED MATERIALS Vantage Vulcan provides great versatility and flexibility. It allows for the processing of multiple substrates simultaneously, with up to 6 different process recipes. In addition, this machine gives precise control over the thickness of each layer, with a very high resolution of 2 nanometers. This precision results in very high productivity levels, since there is less need to re-process unsuitable samples. Vantage Vulcan also offers excellent thermal uniformity, with greatly reduced repeatability variation across all substrate types. This helps eliminate the need for process adjustments and helps increase yields in your production process. It also provides a choice of different reactant sources, including H2, N2/O2, Ar/O2, and others. This makes it suitable for a variety of materials and process types, including advanced metal oxides. Overall, AMAT / APPLIED MATERIALS Vantage Vulcan is an ideal choice for wafer and substrate processing needs, as it provides fast and accurate thermal processing. It has an optimized design to provide high throughput and maximum accuracy, as well as excellent thermal uniformity and homogeneity. Additionally, it offers great versatility and flexibility, with multiple process recipes and reactant sources. This tool is compact and efficient, making it highly cost-effective.
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