Used AMAT / APPLIED MATERIALS Vantage #9225981 for sale
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ID: 9225981
Wafer Size: 12"
Vintage: 2006
Rapid Thermal Processing (RTP) system, 12"
Wafer type: SNNF
A & B Chamber type: RTP Radiance RP vantage
A & B RTP Radiance RP vantage chamber:
Process application: Core anneal RTO & ISSG
O2 Analyzer
Lamp driver, P/N: 0190-17056
MFC 1: N2 50 slm HORIBA Stec sec-z12dmn
MFC 2: O2 50 slm HORIBA Stec sec-z12dmn
MFC 3: O2 5 slm HORIBA Stec sec-z11dm
MFC 7: H2 20 slm HORIBA Stec sec-z12dm
MFC 8: H2 3 slm HORIBA Stec sec-z514mgx
MFC 11: He 30 slm HORIBA Stec sec-z12dm
MFC 12: He 50 slm HORIBA Stec sec-z12dm
MFC 13: N2 100 slm HORIBA Stec sec-z12dmn
WRLD Maglev assembly, P/N: 0190-14175
Interface options:
OHT WIP Delivery
Loadports, enhanced 25-wafer foup
OHT Light curtain
Chamber A interface: Radiance interface panel, P/N: 0465-07030
Chamber B interface: Radiance interface panel, P/N: 0465-07031
Remote options system monitor:
Monitor 1: Flat panel with keyboard on stand, P/N: 0395-00099
Monitor 1 cable, 25 Foot
Monitor 2: Through the wall flat panel with keyboard, P/N: 0460-50048
Monitor 2 cable, 25 Foot
Umbilicals:
Chamber AC Box to heat exchanger, 75 Feet
H/A, AMAT / APPLIED MATERIALS KVM to user interface with EVC, 25 FT
P/N: 0140-06462 / 0150-13813 / 0150-14109
Robot, YASKAWA BTV Darp manipulator, QS Vantage FI, P/N: 0220-39516
Reflective wafer on blade, P/N: 0220-39702
Cables, P/N: 0150-14109 / 0150-13813 / 0140-06462.
(2) Facility bracket / Cover
(2) Front monitors, keyboards & bezels
Exhaust line and KF flex hoses
Gasline adapter: 90° Elbows
Options & electrical requirements:
Line voltage: 200/208 V
System safety equipment
Mainframe
Process chamber options
No heat exchanger
No rough pumps
2006 vintage.
AMAT / APPLIED MATERIALS Vantage is a high-performance rapid thermal processing equipment developed for thin-film rapid thermal processing applications. It provides fast, high-quality annealing, deposition, pre-deposition, and thermal treatments for a variety of semiconductor materials. The system is designed to ensure uniform temperature distribution across a substrate with a large uniformity region and precision temperature control. It features three process chambers, each capable of accurately controlling temperatures up to 1200°C-the highest temperature of any rapid thermal processor on the market. AMAT Vantage's patented vertical reaction chamber allows precise placement of hot substrates, and its integrated, linked laser temperature sensor quickly and accurately measures temperature with the press of a single button. In addition, the chamber's two-stage vertical delivery and horizontal lift-off mechanisms allow the highest throughput and substrate step sizes in the industry. APPLIED MATERIALS Vantage also features the latest in process control and monitoring technology. Its automated process execution unit helps ensure consistent and repeatable results by automating all the steps of the rapid thermal process. It provides multiple recipes that are easy to configure and tweak to ensure that process performance meets the user's exact requirements. The machine can also be monitored remotely over an Ethernet connection. Lastly, Vantage is user friendly and easy to integrate. Its all-in-one design makes it quick and easy to install, and its operable without the need to build complex flow control hardware. Additionally, AMAT / APPLIED MATERIALS Vantage features a fully networked platform for seamless data management across the enterprise. Overall, AMAT Vantage is an ideal tool for high-precision rapid thermal processing applications. Its unbeatable process temperature range, advanced process control and monitoring, and easy integration make it the perfect choice for companies looking for fast, accurate, and repeatable process results.
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