Used DNS / DAINIPPON LA-820 #9198165 for sale

DNS / DAINIPPON LA-820 is a rapid thermal processor (RTP) specifically designed for applications in advanced microfabrication and device characterization. It is a robust and reliable equipment with high accuracy and repeatability. The system is capable of producing thermal cycles with a cycle time of 10 ms for each repeat. It offers a thermal process temperature range of -150°C to 550°C with a resolution of 0.1K and a temperature uniformity of ±2K. The unit includes a rapid heated hotplate fitted with a furnace that has a thermal cycling capability, as well as an enclosed reaction chamber complete with inert nitrogen or argon gas supply machine. The reaction chamber allows for the processing of up to four wafers, each measuring 8 in. in diameter. The chamber has a chamber temperature range of 25°C to 350°C with a resolution of 0.1K and a temperature uniformity of ±2K. The tool also includes a four-axis translation stage which allows for precise and accurate control of the wafer position and orientation during thermal processing. The integrated control asset provides high accuracy and precision. It can also detect any anomalies during thermal processing making it suitable for use in high-precision, complex thermal processes. The integrated data logging software enables users to monitor various process parameters, such as temperature, gas concentration, and flow rate. DNS LA820 is equipped with several safety features, including a closed-loop temperature control model, fail-safe sensors, and automatic shut off for over-temperature situations. The equipment also includes a thermal manipulation software that enables users to program device thermal cycling sequences, including ramp-up/cool-down sequences, with high precision. DAINIPPON LA 820 is an ideal system for advanced microfabrication and device characterization. It offers a very rapid thermal cycling capability and a robust and reliable unit with high accuracy and repeatability. It is suitable for the processing of multiple wafers with a range of thermal profiles, making it suitable for a variety of applications.