Used KORONA RTP-1200 Plus #9411492 for sale

KORONA® KORONA RTP-1200 Plus rapid thermal processor is a high-performance, modular rapid thermal processor capable of performing rapid thermal processing (RTP) and rapid thermal annealing (RTA) of semiconductor wafers. The processor features a constant-rate, high-temperature, four-zone horizontal furnace, a vacuum loadlock, and a forced-air cooling equipment with dual sets of cooling coils. The processor is also capable of in situ real-time recombinative deposition. The four-zone constant-rate direct thermal processor is equipped with rapid thermal chambers. The four oven chambers are heated with an independently adjustable power supply, allowing for traditional or advanced RTP or RTA recipes. The four zones are heated and cooled separately and can be operated sequentially or simultaneously. The processor has the capability to ramp up a wafer in less than 30 seconds, cool it down to a user-specified temperature in 10 seconds, and retain the wafer at a significantly lower temperature. To ensure precision accuracy and repeatability of RTP-1200 Plus, the PLC-based control system employs advanced process temperature monitoring and control. The unit is designed to monitor and control the temperatures of the entire process chamber, including both the upper and lower heaters. The control machine also has the capability to monitor and control the temperatures of each zone independently. The vacuum loadlock tool helps to maintain precision-controlled processing. The loadlock for the processor is equipped with a target pressure control, which is able to maintain the chamber pressure at a predetermined level, so that it does not interfere with the thermal processing of the semiconductor wafer. The forced-air cooling asset ensures efficient heat transfer from the process chamber to the ambient air, thus ensuring that the temperature of the processed wafers remains at the desired level. Dual sets of cooling coils are used to enable high-speed cooling of the wafers. KORONA RTP-1200 Plus also has the capability to perform in situ real-time recombinative deposition. The processor uses a specially designed RTP-CVD or RTP-PECVD coating model, which is capable of depositing uniform thin films on a range of semiconductor materials. KORONA® RTP-1200 Plus rapid thermal processor can process semiconductor wafers in a wide range of temperatures and is capable of performing both RTP and RTA processes. The processor is equipped with a highly accurate control equipment, a vacuum loadlock, a four-zone horizontal furnace, and a forced-air cooling system with dual sets of cooling coils. This processor is an ideal solution for any semiconductor manufacturing facility that requires a reliable and high-performance rapid thermal processor.