Used KOYO THERMO SYSTEMS RLA 3100 #293661476 for sale

KOYO THERMO SYSTEMS RLA 3100 is a rapid thermal processor (RTP) designed for a variety of advanced semiconductor packaging applications, such as flip chip, wirebond, wave soldering and surface mount assembly. The RTP provides fast, precise thermal processing for demanding applications, ensuring superior performance and reliability. With the RTP, it is possible to rapidly heat and cool small packages and micro-devices in a controlled, hazard-free atmosphere, providing an ideal solution for the production of a wide range of advanced semiconductor packages. RLA 3100 offers an up to 6-step rapid thermal profile, allowing for precise and repeatable thermal performance. Each step can be individually set to meet specific requirements. The step-down temperature gradient ensures a uniform temperature profile during the thermal cycle, as well as efficient cooling. KOYO THERMO SYSTEMS RLA 3100 is controlled by a sophisticated computer system, which can be used to program the thermal cycles and allows for data logging to be recorded for further analysis. The operator interface of the RTP is a key part of RLA 3100, allowing for precise control and optimization of the thermal parameters. The LCD screen and intuitive menu allow for easy control of process parameters and data logging, while multiple safety warnings alert the operator when an operation is outside the specified safety limits. KOYO THERMO SYSTEMS RLA 3100 also features multiple control options for automatically controlling the desired thermal parameters. This includes a selectable timer, which can be used to determine the length of the thermal cycle and a selectable setpoint selector, which allows the user to select the target temperature. Additionally, a selectable time delay can be used to program the desired thermal cycle and further ensure that the optimal thermal environment is achieved. RLA 3100 is designed for high throughput, reliability and precise thermal performance and is suitable for a wide range of package types. It provides an ideal thermal processing solution for demanding advanced packaging applications and is suitable for many types of micro-devices.