Used MATTSON HELIOS #9315046 for sale
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ID: 9315046
Wafer Size: 12"
Vintage: 2007
Rapid Thermal Processor (RTP), 12"
Process: IMP
2007 vintage.
MATTSON HELIOS is a rapid thermal processor (also known as a RTP) used in semiconductor manufacturing. Created by MATTSON Technology, HELIOS is a fully automated thermal processing equipment used in chip manufacturing, capable of delivering precise thermal processes that are critical to forming advanced semiconductor products. MATTSON HELIOS RTP is designed for the rapid thermal processing of various substrates, such as silicon, III-V compounds, and wide bandgap materials. It offers an extremely fast thermal processing time, with rapid temperature transitions and uniformity ranges across all wafers. In addition, this RTP is capable of delivering high-temperature and high-dose processes, perfect for applications like doping, implantation, oxidation, nitridation, and metal-organic chemical vapor deposition (MOCVD). The robust design and modular configuration of the system can easily accommodate any specific process requirements. HELIOS RTP is a compact and efficient unit, providing thermal processing in a very small space. It is configured with state-of-the-art thermal control and feedback systems to ensure consistently repeatable temperature profiles, accuracy, and front-end automation. Furthermore, the machine includes an automated front-end robot with integral wafer handling and options like integrated atmospheric temperature and pressure measurement and control. The tool is also designed with best-in-class thermal oxidation and nitridation module, as well as an ultra-clean MOCVD module for the deposition of pure material. It also has optional systems for deposition of aluminum, tantalum and cobalt with tantalum nitride barrier layers that minimize contamination. The asset also features self-cleaning capabilities, high throughput, extra diagnostic tools, and remote support capabilities. Overall, MATTSON HELIOS is a reliable and precise RTP, offering a wide range of advanced features to meet all semiconductor manufacturing needs. It is a cost-effective solution for high-speed thermal processing, offering automated alignment and process control for fast, consistent processing.
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