Used MATTSON HELIOS #9382900 for sale
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ID: 9382900
Wafer Size: 12"
Vintage: 2005
Rapid Thermal Processor (RTP), 12"
2005 vintage.
MATTSON HELIOS is a rapid thermal processor (RTP) designed to rapidly heat and cool semiconductor wafers at rates up to 800°C/sec. It is an ideal tool for a wide range of process applications, such as thermal annealing, oxidation, nitridation, and diffusion processes. HELIOS is designed to quickly process up to 8 inch diameter wafers and can achieve significant temperature uniformity across the full surface of the heated wafer. MATTSON HELIOS features an optimized thermal Load Lock integrated with a proprietary wafer heating system for precise thermal control and fast turnaround times. Its robust design utilizes a repressurized, gas-tight quartz chamber to ensure a consistent process environment free of any external contamination. The thermal loadlock also stabilizes chamber pressure to minimize over- or under-pressurization. The chamber temperature of HELIOS is precision controlled by a PID thermal loop with 0.1°C resolution. The system also utilizes a high accuracy wafer heater and liquid cooling unit for rapid thermal cycling. The liquid cooling unit can be operated using either a closed loop water circulation for temperature control, or a single-shot cooling module for rapid thermal changes. In addition to the thermal capabilities, MATTSON HELIOS also features advanced optical capabilities to monitor and control the process. An integrated fast image collector is used for temperature and defect mapping, while a Photon Emitter Array (PEA) can be used to provide precise wafer position control. HELIOS provides an ideal platform for semiconductor process control and is capable of performing rapid thermal processing of complex wafers up to 8" in diameter. Its compact design and easy-to-use interface make it ideal for OEM applications as well. Thanks to its robust design and advanced thermal and optical capabilities, this system is the perfect choice for any semiconductor process application requiring rapid, high performance thermal cycling.
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