Used STEAG / MATTSON / AST 2800 #9205415 for sale
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ID: 9205415
Wafer Size: 8"
RTP System, 8"
Configuration:
Dual load lock single chamber RTP
General configuration:
30L N2 High:
50psi / 2Bar / Tool, dynamic (Full N2 flow)
60psi / 2.8Bar / Tool, static (No N2 flow)
10L O2 High:
40psi / 2Bar / Tool, dynamic (Full O2 flow)
42psi / 2.5Bar / Tool, static (No O2 flow)
O2 Low:
40psi / 2Bar / Tool, dynamic (Full O2 flow)
42psi / 2.5Bar / Tool, static (No O2 flow)
10L Ar:
40psi / 2Bar / Tool, dynamic (Full Ar flow)
43psi / 2.5Bar / Tool, static (No Ar flow)
CDA:
90psi
Tool: 5.5bar
Chamber high cool:
Bottom: 17/18 m³/h
Top: 26/27 m³/h
Chamber H20 cooling: 6.8LPM
TC Amplifier test
With Omega meter
O2 Sensor final testing:
3ppm O2: 30L N2 Flow in chamber in 30 second
4-5ppm O2: 5L N2 Flow in chamber in 60 seconds
Robot atation names:
A: Primary sender
I: Secondary receiver
F: Furnace
D: Cooling station 0
Cooling station 1 (No cooling station 1, used for dummy station)
C: Dummy wafer station
Pyrometer calibration:
Un-calibrated pyrometer check: Pyro 878C output at 1080TC
With emis 1300
Calibration recipe: TOMCAL.2
Calibration file: TRCAL0923
Network setup:
Network ID / Machine name: 03AST
Facility name:
Serial gemSecs used
Expansion board: COM8
AST 01 and 02 RTP:
Physical dummy wafer station: No
Cooling station: Dummy wafer station C
Gas panel: TYLAN MFC's
Robot:
Equipe 307
No swivel cassette stations
Install connections: 03AST
Gasbox above rear of tool: Supplies MFCs
N2
O2
H2 Mix
Ar
Connections at bottom rear tool:
CDA: 1/4" Swagelok / 90- 120psi
PCWS: 1/2" Swagelok / 8slpm
PCWR: 1/2" Swagelok / 60 - 120PSI
PCWS: 1/2" Swagelok
PCWR: 1/2" Swagelok
HiFlow N2: 1/2" Swagelok / >90PSI in operation
Cooling N2: 1/4Inch Swagelok / 10 - 30 slpm
Vent1: 3/8" Swagelok / Acid exhaust
Vent2: 3/8" Swagelok / Acid exhaust
11/2" Exhaust / 11/2" / Tube acid exhaust
Middle bottom of tool:
Blower output / 4" Tube / Heat exhaust
Front tool:
House vacuum / 1/4" Swagelok / 600 mbar
Power supply: 43KVA / 208VAC / 3 Phase / 125amps / 125 Max fusable.
STEAG / MATTSON / AST 2800 Rapid Thermal Processor is a tool used for high-speed processing of thick films for semiconductor material. It allows for thermal processing of films in an efficient thermal environment, giving a fast ramp rate and eliminating thermal gradients. The processor has built-in air recirculation technology that ensures uniform temperatures during surface heating. The processor's temperature sensors eliminate the effects of thermal gradients and make it more reliable. The high temperature ranges of up to 900°C and 1350°C enable the rapid thermal processing of thick films. It also has a low-pressure oxidation, reduction and nitridation zone, allowing for further fabrication and applications of material during processing. The processor has a variable cooling source with a controller and an additional cooling source for temperature control. It also offers a variety of forced-gas cooling systems including air and nitrogen. The user can select the amount of cooling depending on the application. An additional feature of AST 2800 is its built-in multi-zone programmable software. This allows for the processing of different film thicknesses at different temperatures with each zone having its own controller. A user may also use pre-installed programs for fast setup times and for coordinating multiple recipes with different temperature processes. The processor offers adjustable wafer cassette holders to assure flat and uniform processing. It is also capable of priming, debonding and frontside lecturing processes. The Robot Interface allows full-facet wafer transfer and unloading. STEAG AST2800 is a valuable tool that benefits a variety of industries, such as compound and organic semiconductors. It is used for the rapid thermal processing of materials such as dielectrics and metals, allowing for the fabrication and applications of new semi-conducting materials. The ease of use and accuracy enables increased production and efficiency in a variety of industries.
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