Used STEAG / MATTSON / AST 2900 #9224563 for sale
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ID: 9224563
Wafer Size: 8"
Vintage: 1997
Rapid Thermal Processor (RTP), 8"
Single chamber
Halogen bar lamp type
(38) Lamps:
(17) Top
(17) Bottom
(4) Side
Lamp life time: >2,000 Hours
(3) Cooling stations
Dummy station
RORZE Dual arm robot
Amplifier air vac cooling system
Temperature control: Ripple pyrometer
Lamp control
Z-Purge
Operating system: Windows NT
Maximum ramp up: 100°C/Sec
Maximum ramp down: ~70°C With N2
Temperature range: 550~1250°C
Temperature repeatability: ±2°C
Lamp power: 1500 Watt
1997 vintage.
STEAG / MATTSON / AST 2900 is a high-end rapid thermal processing equipment (RTP) designed for optimizing process development and performance. It features a two-stage process of rapid thermal annealing (RTA) followed by rapid thermal oxidation (RTO), providing users with the flexibility to rapidly control the processing parameters and optimize processes. The system is well suited for commercial, prototype and research applications in a range of specialized processes related to microelectronics, electronic packaging, and semiconductor manufacturing. AST 2900 offers users an impressive combination of processing power and speed, allowing them to rapidly adjust parameters and efficiently complete processing tasks. The TPA temperature chamber on the unit is designed for temperature uniformity and flexibility. It has an adjustable heating rate of up to 150°C/sec and can perform rapid thermal annealing (RTA) or rapid thermal oxidation (RTO) at temperatures up to 1000°C. Its uniformity contrast of the temperature chamber is ≤1.25°C and its temperature uniformity (TU) is 2.25°C or better. The machine uses a closed-loop gas-analysis unit to detect and adjust the oxygen influx needed for rapid thermal oxidation (RTO). This independent thermal and gas-flow control tool is ideal for reducing the oxygen/nitrogen throughput rates, minimizing the off-gassing to the desired consumption levels to accurately determine the TOX and RTO requirements. STEAG 2900's rapid thermal processing capabilities are further complemented by its programmable choice of process and furnace control parameters: static pressure control, high pressure gas control, temperature, gas flow, ampere/power control, and frequency control. This range of control options allows the user to adjust the processes for optimal results. The asset also features advanced data logging and graphing capabilities, designed to monitor model performance and detect process anomalies at an early stage. The user friendly graphical user interface (GUI) provides real-time monitoring of the RTP process, enabling quick and effective diagnoses. Overall, 2900 is an efficient and reliable rapid thermal processor, perfectly suited for advanced prototype development, process design, and commercial production requirements. It features a wide range of advanced process control settings, temperature uniformity, oxygen influx adjustment, and data logging capabilities, allowing users to efficiently optimize processes for optimal outcomes.
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