Used AIXTRON Crius 31x2 #293587449 for sale

Manufacturer
AIXTRON
Model
Crius 31x2
ID: 293587449
Vintage: 2008
MOCVD System 2008 vintage.
AIXTRON Crius 31x2 is a reactor designed for a variety of industrial applications, including semiconductor production, sputtering and thin-film deposition, and etching processes. AIXTRON CRIUS 31 X 2 is equipped with innovative cooling technology, allowing for processes with low thermal budgets. The reactor is equipped with two independent process chambers which can be operated either electrically or with single or dual gas lines to supply multiple gases or facilitate LPCVD and PECVD processes. The process chambers are encased in a stainless steel vacuum vessel, which is equipped with a primary gatevalve, a two-stage vacuum equipment, a flexible gas control system, and a variable speed diffusion pump. In addition, Crius 31x2 comes fitted with its own Advanced Throttle Supervision (ATS) unit to precisely control processes. This machine provides detailed feedback on chamber temperatures, temperatures inside the sample holders, and substrate heating and cooling power. CRIUS 31 X 2 has a host of features that make it a desirable choice for many users. For instance, it features an innovative high-density, multi-zone mass data tool with the capability to change zoneconfiguration on a Wafer-by-Wafer basis. The reactive plasma source has a built-in quench asset and dimmer control which can actively adjust source power to match the requirements of different processes. AIXTRON Crius 31x2 also features a uniformity scanner, a programmable lift pin and indexer mechanism, and a large size range of susceptors. Overall, AIXTRON CRIUS 31 X 2 is a reliable and versatile reactor. It has a wide variety of features, making it suitable for a range of applications and processes. Its Innovative cooling technology allows for low thermal budget processes, and it provides users with detailed feedback of temperature and substrate heating and cooling power. With these advantages, Crius 31x2 is an excellent choice for production, sputtering and etching processes.
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