Used AIXTRON G3 ICHT #9296290 for sale

AIXTRON G3 ICHT
Manufacturer
AIXTRON
Model
G3 ICHT
ID: 9296290
System.
AIXTRON G3 ICHT is a leading vapor deposition reactor used in advanced semiconductor manufacturing. It is designed to provide reliable, precise and high productivity performance for the production of nano-structured semiconductor materials and structures. It is widely used for MOCVD (Metal Organic Chemical Vapor Deposition), PECVD (Plasma Enhanced Chemical Vapor Deposition) and thick film depositions. This advanced CVD reactor equipment consists of four main components: driver, chamber, power supply and cooling system. The driver is the heart of the reactor and used to control the process of deposition. It is composed of two parts: the PC-controlled "Interface" and the DC-driver. The Interface is used to control process parameters such as process pressure, deposition speed, etc. The DC-driver is used to drive deposition sources which are electro-chemically activated, allowing for very fine deposition at ultra-low temperatures. The reactor chamber is made from stainless steel and is equipped with Teflon and quartz windows for viewing the process. There are two rectangular openings at the top and the bottom, enabling the process gas to be heated and appropriate for subsequent reactions. An optical window at the top also ensures efficiency in controlling the process and monitoring the growth of the material. The DC power supply provides power to the driver and sources, determining the voltage during the deposition. The temperature of the process is monitored and controlled by a cooling unit consisting of a cooling tray, a water cooled wall and a temperature sensor. This cooling machine allows for very precise control over temperature during the deposition. G3 ICHT is a versatile, reliable and accurate CVD reactor capable of producing high-quality semiconductor materials with excellent uniformity and uniformity of thickness. Its robust design enables fast deposition of high quality films and it offers flexibility in terms of process design, enabling deposition of a wide range of materials even at ultra-low temperatures. Moreover, the tool's solid state reliability and fine process control can overcome the challenges associated with traditional CVD processes.
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