Used AIXTRON LYNX-iXP #9092600 for sale
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ID: 9092600
Wafer Size: 12"
CVD system, 12"
Process: metal films
SiH4-based WSi
DCS-based WSi
Tungsten (W)
Ultra-thin WSi film
15L MKS RPC Clean
(1) Brooks Transfer Module
(3) Process Module
AC Rack
Monitor Rack.
AIXTRON LYNX-iXP is an advanced turnkey plasma processing equipment designed for research and production applications in semiconductor manufacturing. It incorporates a high-power deposition source capable of depositing ultra-thin layers of metals and other materials at incredibly high rates, with uniformity and accuracy. The system is also equipped with a unique interactive process chamber, providing the flexibility to rapidly adjust process conditions according to the application. With LYNX-iXP, customers are able to conduct their process operations with greater speed, efficiency, and cost savings. AIXTRON LYNX-iXP comes equipped with a built-in automatic wafer handling unit, designed to provide uninterrupted and reliable processing to reduce the risk of potential contamination and damage to the wafer being processed. Its stable, high-precision automatic loading ensures efficient throughput and improved yield, even during operation with larger wafer sizes or materials with higher deposition rates. LYNX-iXP is powered by an advanced plasma generator, allowing users to program their deposition parameters precisely and independently of each other. This allows for a high degree of process uniformity from one process step to the next, whether it be layer thickness, chemical composition, or surface topography. This precision also makes AIXTRON LYNX-iXP the ideal tool for the deposition of specialty materials or for the deposition of nanometer-scale features. For safety and efficiency, LYNX-iXP features an integrated advanced in-situ Purge Machine (IPS), which allows users to quickly and accurately adjust the pressure, temperature, flow rate, and mixture of the tool. This helps to maintain the quality of the process while keeping methane and other reactants within the safety limits. AIXTRON LYNX-iXP also features multiple interface capabilities, providing the flexibility to integrate with a variety of existing systems and to combine process parameters and overlaid measurements. The self-monitoring asset allows users to optimize process conditions while continuously monitoring the overall performance. The model can also be upgraded as user demands increase, allowing for a smooth transition from research to production. In conclusion, LYNX-iXP offers users a complete turnkey plasma processing solution, with precision and flexibility to meet the needs of a wide range of applications. By combining advanced automation, high-precision tools, and integrated processes, AIXTRON LYNX-iXP can improve the efficiency and cost-effectiveness of the production process.
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