Used AMAT / APPLIED MATERIALS 0010-03254 #9312941 for sale

AMAT / APPLIED MATERIALS 0010-03254 Reactor is a versatile thin-film deposition equipment designed for experiments involving chemical vapor deposition (CVD) and physical vapor deposition (PVD). The reactor chamber is constructed of stainless steel, with a quartz substrate holder and resistive-heater susceptor. It is capable of ultralow-pressure to high vacuum processing with operation up to 1000˚C. AMAT 0010-03254 Reactor is a reliable source of deposition onto multiple types of substrates with precise temperature uniformity and a process gas mixing system. The unique showerhead design and length of the reactor chamber allows for uniform film deposition onto substrates even under high-growth rates and high-vacuum conditions. APPLIED MATERIALS 0010-03254 Reactor features a full-face deposition area and a central lift out door with a manual or motorized lift unit for substrate sample loading and unloading. The lid of the machine can be opened to the full face of the top showerhead for substrate cleaning or laser ablation. 0010-03254 Reactor provides precise control over process gases with precise mixing and mass flow control. The dual zone processes allow a process chamber temperature as low as 25˚C while depositing films. The temperature at the center of the substrate can be precisely regulated on a range from 25˚C up to 1000°C, with a precise temperature uniformity of ±2°C. AMAT / APPLIED MATERIALS 0010-03254 Reactor allows for automated source material refilling and substrate exchange, eliminating manual intervention in a production workflow. An advanced gas delivery tool maintains precise control of the residual pressure and flow of process fluids. The asset is designed to operate on acetylene, silane, ammonia, and other process gases. Unique pilot and main valves provide precise flow control. The advanced features of AMAT 0010-03254 Reactor provide precise thin-film deposition for a wide range of applications such as thin-film CVD, PVD, ALD, and sputter deposition. The design ensures uniform film deposition over large area substrates with minimal cross-contamination and substrate damage. In addition, the increased deposition rates provide cost savings by reducing cycle times and improving productivity.