Used AMAT / APPLIED MATERIALS 0010-03843 #9269048 for sale

AMAT / APPLIED MATERIALS 0010-03843 is a vapor deposition reactor designed to deposit a thin film onto a substrate. The reactor is capable of working with metal oxide materials, allowing users to create single or multilayer deposition with a variety of thin film properties desired. The design of the reactor has an ultra-low deposition chamber pressure, and features a radio frequency source for heating the substrate. The reactor also comes equipped with quartz walls to allow for efficient heat transfer and to keep the temperature of the interior fairly consistent. The contained microwave power is adjustable with a patented "air-cooled" design which helps reduce loss of energy. The reactor is a neutral pressure type with vertical orientation, allowing user to deposit material on either side of the substrate. The substrate is held in a Low Thermal Mass (LTM) wafer holder which has a Water Co-current Gas Flow (WCGF) for efficient heat transfer. This holder is positioned at the bottom of the reactor so that excess materials can be easily collected later. This design along with its adjustable pressure availability, makes this a perfect system for creating multilayer films for semiconductor fabrication. In addition, the reactor also has a few safety features incorporated in its design. This includes numerous possible volatile organic compound (VOC) sensors that detect the presence of any toxic fumes at any point in the reactor's operation and can shut down if unsafe levels are detected. The reactor also has a flame arrestor and grounding system for any potential gas fires. Overall, the design of AMAT 0010-03843 vapor deposition reactor gives users maximum flexibility during the deposition of their multilayer films, while also providing safety features that ensure the safety of the operator. With its adjustable pressure as well as additional equipment to ensure quality and precision, this makes the reactor a perfect system for those looking to create reliable and robust thin film multilayer films.