Used AMAT / APPLIED MATERIALS 0010-36408 #9177210 for sale

AMAT / APPLIED MATERIALS 0010-36408 is a single-wafer concentric inductively coupled plasma (ICP) reactor equipment widely used in advanced material and device processing. It offers a number of advantages over traditional reactor systems, such as a higher-throughput process and better process control. This makes it well-suited for a variety of plasma applications, including etching, deposition, and oxidation/reduction. The reactor features a dual-laser source which helps to improve the uniformity of the plasma and to effectively clean the wafer surface. The laser source is located outside the main chamber, allowing increased process reliability and control. The dual-laser allows for better control of the plasma parameters, enabling more efficient operation. The reactor can handle 200-300mm diameter wafers and has a maximum RF power of 1.2kW and up to 4kW of inductive power. The RF power can be set from zero to any frequency, enabling precise control of the plasma power. The upper shield is used to produce a uniform, temperature-stable atmosphere which is suitable for diffusion processes. The system is equipped with a RF feedback loop which continuously monitors the plasma power to enable precise control of its parameters. This provides for a highly accurate and repeatable process. The reactor also features variable-speed convection control to maintain a uniform plasma distribution. This allows for more uniform material deposition across the wafer. This is particularly useful for anisotropic etching applications, where the material must be uniformly etched from all surfaces. The unit is designed for both on-site installation and portable systems. It is fully customizable depending on specific process requirements, and it can be set up for complex custom recipes. It also includes multiple safety features for process safety. AMAT 0010-36408 reactor is a highly versatile machine for material processing and device fabrication applications. It offers fast processing rates and provides higher process control than other systems. It is suitable for use in a variety of industrial, research, and educational settings.