Used AMAT / APPLIED MATERIALS 0010-36408 #9207766 for sale

AMAT / APPLIED MATERIALS 0010-36408 is a PECVD reactor, also known as a plasma-enhanced chemical vapor deposition (PECVD) reactor, is a device used for depositing thin films on a substrate. The PECVD reactor consists of a vacuum chamber in which the deposition process takes place, a source of energy in the form of an arc discharge or RF (radio frequency) generator to initiate the phenomenon of ionization, and a gas management equipment to provide accurate and precise delivery of reactive gases to the chamber. The vacuum chamber of the PECVD reactor is made of stainless steel and is designed to maintain a high vacuum level of up to 10-5 Torr. It is equipped with two viewports and a quartz-lined etching section for easy observation during operation. The source of energy provides an arc discharge between two electrodes in the chamber and is mainly used to sustain glow discharge. Alternatively, an RF generator can be used to create plasma, which is a non-equilibrium, partially ionized gas composed of atoms, molecules, and free electrons with high temperatures (>1000 °C). The gas management system enable precise control of gas flow and pressure from a wide variety of gas sources in order to obtain different materials and film parameters. To perform a deposition, a substrate needs to be inserted in the deposition chamber and placed on an electrode. The gas management unit is setup to provide a desired flow of reactive gases to the chamber, depending on what material should be deposited. The source of energy is activated to trigger the deposition process, which consists of a series of plasma discharges between the electrodes. Special designed shielding plates are installed to direct the plasma flow towards the substrate. The deposition process is complete when the predetermined number or time is reached. The end result is a thin film coating of desired material on the substrate. The PECVD reactor is widely used in the semiconductor industry to fabricate microelectronic components since it provides excellent uniformity, conformal coverage, and smooth surface. It also has the advantage of being able to deposit a variety of materials like metals, ceramics, polymers, and dielectrics. Additionally, the PECVD reactor can be used to deposit coatings for optical applications, coatings for wear and corrosion protection, and thin films for solar cells. In conclusion, AMAT 0010-36408 PECVD reactor is an effective device for depositing thin films on substrates. It consists of a vacuum chamber, a source of energy, and a gas management machine for reliable and precise control of gas flow. The PECVD reactor is used in a variety of industries for different applications, making it an indispensable tool for thin film deposition.