Used AMAT / APPLIED MATERIALS 0010-65541 #293660489 for sale

AMAT / APPLIED MATERIALS 0010-65541 is a multi-chamber process reactor designed for semiconductor device fabrication. It is used for etching, sputter deposition, and rapid thermal processing of wafers, and is suitable for both 150mm and 200mm wafers. The unit consists of a stainless steel mainframe, an independent controller, a power board, a vacuum pump assembly, and a water-cooling unit. The power board houses the power supply for both the RF sputter and the high voltage DC sputter chambers, enabling the chambers to operate at high power levels. It also provides flow control for gas introduction from the external gas sources to the process chamber. The control equipment operates a user interface, allowing the user to control the process, monitor the process parameters, set up the process parameters, and maintain the process. The chamber of AMAT 0010-65541 has multiple components, such as two sputter sources, a gas source, and a coolant system. The two sputter sources provide different types of processes for depositing thin films of semiconductive material, such as oxides and nitrides. The sputter process is used to either deposit or etch away materials. The coolant unit helps maintain a stable wafer temperature during processing, while the gas sources provide certain chemical additives to the environment of the processing chamber. The unit also contains a vacuum machine, which sucks out all the air present in the chamber before processing and maintains the pressure inside the chamber during processing. This is important for maintaining the purity of the resulting wafers and controlling the reaction between the process gases and the substrate. The vacuum tool is also connected to a dedicated vacuum pump assembly. The vacuum pump assembly is designed to pump out the waste gases created during processing, thus improving the purity of the chamber atmosphere. APPLIED MATERIALS 0010-65541 reactor provides a variety of features for precise and efficient wafer fabrication. Its multiple sputter sources, gas sources, and coolant asset provide a wide range of processing capability. Its reliable vacuum model maintains the process atmosphere, while its independent controller allows the user to precisely control and monitor the equipment. Its compatibility with both 150mm and 200mm wafers makes it suitable for a wide range of fabrication processes. All of these features make the unit an excellent choice for device fabrication and a reliable and efficient tool for semiconductor manufacturing.