Used AMAT / APPLIED MATERIALS 0242-73400-1 #9129478 for sale

AKT/AMAT / APPLIED MATERIALS / AKT 0242-73400-1 is a dual-chamber, low pressure, chemical vapor deposition (CVD) reactor. It is designed to efficiently deposit thin films of many materials, such as dielectrics, nitrides, conductive oxides, and other metals on all kinds of semiconductor substrates. The main feature of this reactor is its compact size and flexibility. It can be adapted to fit different process chamber configurations. The reactor is equipped with two process chambers, with the first being the primary chamber. The primary chamber is the core of the CVD process, and is the one that houses the substrate. It is composed of a quartz reacter tube, a stage/substrate holder, an exhaust zone, and a heated section. Both the primary and the second chamber are fitted with manual valves, allowing for the controlled introduction of gases. The quartz reactor tube is responsible for the transport of gases during the deposition process, and is capable of operating with temperatures ranging from 25 to 1000°C. The heated section is where the substrate is heated for the deposition process. It is connect to a heating coil and is adjustable between 0 and 1000°C. The substrate holder itself is equipped with an exhaust system to ensure proper pressure control during the deposition process. The secondary chamber is used to process the gases prior to their introduction into the primary chamber. It is composed of a heating block, a gas introduction zone, a manifold, and a filter. The gas introduction zone allows for the controlled introduction of gases, as well as the introduction of chemicals such as silane and chloroaluminates. AMAT/AKT 0242-73400-1 is an ideal reactor for depositing thin films on all kinds of semiconductor substrates. Its small size and the possibility of adapting to different chamber configurations allow for a great degree of flexibility. Additionally, its capacity to work with a wide range of temperatures and gases enables it to deposit a variety of materials on substrates, allowing for a great degree of process control.