Used AMAT / APPLIED MATERIALS 1600 #9156161 for sale
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ID: 9156161
PECVD Chamber
Front
Front Monitor: Ok
Back Monitor: Ok
Load port: Sensors, Cass plate
Signal tower: R,Y,G,W
Robot: ATM robot & Vacuum chuck
Slit door: Open
Laminar flow: Load port laminar flow
Wafer transfer module
Robot: No
Baratron gauge: No
Buffer door lift : Ok
Buffer Isolation valve: Ok
Buffer throttle valve: Ok
Cool chamber: Ok
Process module
CH# A RF Match: HMN302D
CH# B RF Match: Ok
CH# C RF Match: Ok
CH# D RF Match: No
CH# A Gate valve: No
CH# B Gate valve : AV-4.0-MOD
CH# C Gate valve: Ok
CH# D Gate valve: Ok
CH# A Throttle valve: 153F-4-100-2
CH# B Throttle valve: No
CH# C Throttle valve: Ok
CH# D Throttle valve: Ok
CH# A Heater lift: No
CH# B Heater lift: No
CH# C Heater lift: Ok
CH# D Heater lift: No
Controller Board: DI/O,AI/O : Ok
DC power supply: Ok
CH# A Baratron gauge: MKS
CH# B Baratron gauge :Ok
CH# C Baratron gauge : Ok
CH# D Baratron gauge : Ok
Regulator box
Span sensor: Ok
Manual v/v & Regulator: Ok
Gas panel
NF3: 2SLM
Ar: 300SCCM
NH3: 2500SCCM
N2: 5SLM
SiH4: 500SCCM
1%PH3/H2: 1SLM
H2: 3SLM
B2H6
System control rack
Interface board: DI / O, Seriplex, VME, CPU
DC power supply: Ok
Pump control module: Ok
Servo DC power supply: Ok
Main frame
Power rack
Generator
Chamber A RFPP RF20S: 2666
Chamber B RFPP RF20S: NPG2K10S005
Chamber C RFPP RF20S: No
Chamber D RFPP RF20S: No
Pump
Chamber A QMB500 + QDP80
Chamber B QMB500 + QDP80
Chamber C QMB500 + QDP80
Chamber D QMB500 + QDP80
TM pump QDP40
Load/Lock chamber QDP40
Scrubber:
Main scrubber CDO859
Back-up scrubber CDO858
Heatexchanger SPEED-7000
Missing and ETC parts :
ETC: Part step ( scaffolding ).
AMAT / APPLIED MATERIALS / AKT 1600 reactor is a large-scale chemical vapor deposition (CVD) system designed for semiconductor applications. It is a state-of-the-art industrial reactor for producing thin film materials and structures. The systems advanced deposition technology offers superior single-wafer uniformity, excellent process control, reliable operation, and low cost of ownership. The reactor is equipped with a high-power, gas-cooled electron gun connected by a thermionic gun amplifier that allows precise control over the substrate temperature, chamber pressure, gas flows, and deposition rate. An etch collar helps reduce particle contamination, while its metal drum-based design further enhances uniformity and copper-based thin films. The reactor can accommodate a variety of substrates up to 152mm in diameter, including silicon wafers, gallium arsenide, quartz, glass, and aluminum oxide. It can process a wide variety of materials, from semiconductor metals such as aluminum, copper, and nickel to dielectrics such as silicon nitride and aluminum oxide. The system is equipped with a number of advanced features, such as an automated source tuning, vacuum level control, plasma diagnostics, automated gas delivery, and test scripts to help streamline the process. The color touch screen display and intuitive graphical user interface (GUI) allow users to quickly and accurately monitor all the parameters of the run. Additionally, AKT 1600 reactor is supported by a wide range of options, including multiple load lock chambers, parallel process chambers, and an atmospheric module for pre- and post-processing of samples. Overall, AMAT AKT1600 CVD system is capable of producing high-quality, low-cost thin films with excellent uniformity. Its advanced features and easy-to-use graphical user interface make it an ideal choice for processes requiring superior deposition quality and reliability.
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