Used AMAT / APPLIED MATERIALS (8) Chambers for Endura II #293669863 for sale

AMAT (APPLIED MATERIALS) Endura II is a highly advanced plasma reactor designed to accommodate a wide range of plasma treatments, deposition processes, surface modifications and other specialized applications. The reactor is comprised of 8 individual chambers that can be individually configured to meet specific needs of different industries. Each chamber is designed to maintain a certain temperature and pressure to produce a desired effect on the processed material. The first chamber in AMAT / APPLIED MATERIALS Endura II is a ring-shaped induction coil temperature chamber. This chamber is designed to provide precise temperature control to ensure an optimal productivity. A heavy metal inductor restricts radiative heat transfer and is surrounded by a dielectric shield to prevent heat leakage. This chamber is used for pre-treatment of materials such as annealing, etching, and pre-deposition. The second chamber is a high-pressure direct-plasma generator. This reactor is designed to produce positive ions which are highly reactive and useful in the process of surface modifications. The ion density inside the chamber is very high and produces a uniform discharge. This chamber is used for treatments of substrates such as ion milling, hardmask etching and sputter deposition. The third chamber is an ultra-low pressure chamber for plasma experimentation. This chamber is designed to minimize the loss of reactants and ensure a homogenous environment. The chamber can be operated up to a pressure of 0.1 Torr. It is mainly used for thin-film deposition processes and the development of monomers or particles. The fourth chamber is a remote sputter deposition chamber. This chamber is designed to deposit thin-films onto substrates with a high precision and accuracy. This chamber is typically used for the deposition of conductive, magnetic, semiconductor and other specialized layers. The fifth chamber is a modularized packet cluster which is used for efficient deposition of thin substrate layers. The packets can be arranged individually or they can be combined to create complex structures and layers with different compositions. Additionally, the chamber is equipped with automated in-situ diagnostics and an ion-beam etcher. The sixth chamber is a surface analysis chamber. This chamber is designed for surface modifications such as etching, annealing, and thin-film deposition. Additionally, the chamber houses an optical microscopy diagnostic system which can be used to analyze surface morphologies. The seventh chamber is an advanced laser ablation module. This module is used for conformal coating, wafer-level patterning and structural modifications. The chamber houses a high-power pulsed laser which is used to create intricate patterns and other functional structures. The eighth and final chamber is the post-treatment chamber. This chamber is designed to control the deposition rate of films on substrates, and is equipped with the necessary hardware and software to control the environment and to post-process the films. It is a vital part of the Endura II and it is used as a final stage for treatments before being sent to customers. Overall, the 8 individual chambers of AMAT (APPLIED MATERIALS) Endura II are designed for a variety of plasma treatments, deposition processes, surface modifications and specialized applications. The chambers provide precise temperature control, ion-beam etching, optical microscopy analysis, laser ablation modules and post-treatment processing. It is an advanced plasma reactor that helps manufacturers produce high-quality products in an efficient and cost-effective manner.