Used AMAT / APPLIED MATERIALS Endura 5500 #9078245 for sale
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ID: 9078245
Wafer Size: 8"
Vintage: 1995
System, 8"
Wafer Transfer:
Loadlock Type: NB, Tilt-Out
Buffer Robot Type: HP
Transfer Ch Robot Type: HP
Ch#A: Cool-down
Ch#B: Cool-down
Ch#C: PC-II
Ch#D: None
Ch#E: Ori/Degas
Ch#F: Ori/Degas
Chamber 1:
Chamber Process: AL
Wafer Chuck: 101
Chamber Body: NB STD
Wafer Heater: Moterize/101 Pedestal
Cryo Pump: 2 Phase
Gate Valve: 2 Position
Chamber 2:
Chamber Process: Ti
Wafer Chuck: 101
Chamber Body: WB STD
Wafer Heater: Moterize/101 Pedestal
Cryo Pump: 2 Phase
Gate Valve: 2 Position
Chamber 3:
Chamber Process: AL
Wafer Chuck: 101
Chamber Body: NB STD
Wafer Heater: Moterize/101 Pedestal
Cryo Pump: 2 Phase
Gate Valve: 2 Position
Chamber 4:
Chamber Process: Ti
Wafer Chuck: 101
Chamber Body: WB STD
Wafer Heater: Moterize/101 Pedestal
Cryo Pump: 2 Phase
Gate Valve: 2 Position
AC Power:
60 Hz
480V/208V TRSF
Generater Rack:
1st & 2nd
L12 X 2, 20K X1, 10K X2
(2) Cryo compressors: 9600
Pump:
System: QDP40
PC-II QDP40+250RB
Chiller:
Model: Neslab-III
Signal Cable: 50ft STD
1995 vintage.
AKT/AMAT / APPLIED MATERIALS / AKT Endura 5500 reactor is an advanced chemical vapor deposition (CVD) equipment designed for research and production of organic thin-film materials. This reactor system is highly versatile and has the capability to produce thin-films of various materials, such as dielectrics, semiconductors, organic films, barrier materials, and magnetic materials. AKT Endura 5500 utilizes a modular design which is both cost-effective and space-saving, with its chamber only requiring 2 feet by 3 feet of ground space. AMAT ENDURA 5500 reactor chamber offers a powerful gas delivery control unit that is ideal for complex deposition processes. A series of gas mixing valves allow for temperature and pressure control inside the chamber, so high deposition rates can be achieved with a minimum gas usage. The delivery valves settings can be automatically adjusted based on the desired temperature of the deposition process. The temperature can be varied from room temperature to a maximum of 700°C. Additionally, the pressure can be adjusted from a few millibars to atmospheric pressure. AMAT Endura 5500 reactor also offers precise measurement control of thin-film materials. It utilizes a real-time thickness monitoring machine which can measure thin-film thickness up to 5 microns with an accuracy of 0.1 microns. This monitoring tool allows for quick and fast measurements with optimal quality control of deposited materials. APPLIED MATERIALS Endura 5500 reactor utilizes a directed reactive etching (DRE) technology that allows for high-throughput processing. This technology uses a beam of aerosol ions to precisely etch layers from the substrate and thus produce film layers of submicron thickness. The DRE process also enables precise control of the material micro-chemistry in the film deposition process, making it ideal for nanomaterial researches. Moreover, AMAT / APPLIED MATERIALS / AKT ENDURA 5500 reactor offers simplistic maintenance. The modular design of the asset allows service technicians ease access and cleaning, as well as ease removal and replacement of components. Endura 5500 reactor is built with safety features for protection both the model and the operators, such as an automatic pressure control equipment and sliding doors. AMAT/APPLIED MATERIALS ENDURA 5500 reactor is a reliable, high-throughput CVD system that offers researchers and production line workers advanced flexibility and precision in material deposition. It provides excellent control over parameters such as temperature, pressure, micro-chemistry, and nanomaterials, allowing for optimal control and quality outputs.
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