Used AMAT / APPLIED MATERIALS Endura 5500 #9112164 for sale
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ID: 9112164
Wafer Size: 8"
Vintage: 1999
PVD System, 8"
Process: STD AL/TiN
Wafer type: SNNF
Buffer robot: HP
Transfer robot: HP
Wide body load lock with auto-tilt in/out
Sliding sensor kit: no
Chambers A/B:
Chamber type: cool down
Chamber lid: metal lid
Cooling method: By PCW / By Gas
Chamber C:
Chamber type: empty
Chamber process: PCII
RF generator / DC power supply 1: LF-10
RF generator / DC power supply 2: CPS-1001
RF generator / DC power supply 3: -
Turbo / cryo pump type: 361C
Chamber D: -
Chamber E: Orient / Degas
Chmaber F: Orient / Degas
Chamber 1:
Chamber type: STD body
Chamber process: TiN
RF generator / DC power supply 1: MDX-L12
RF generator / DC power supply 2: -
RF generator / DC power supply 3: -
Turbo / cryo pump type: CTI OB-8F
Chambers 2:
Chamber type: wide body
Chamber process: AL
RF generator / DC power supply 1: -
RF generator / DC power supply 2: -
RF generator / DC power supply 3: -
Turbo / cryo pump type: CTI OB-8F
Chambers 3:
Chamber type: wide body
Chamber process: AL
RF generator / DC power supply 1: MDX-L12
RF generator / DC power supply 2: -
RF generator / DC power supply 3: -
Turbo / cryo pump type: CTI OB-8F
Chamber 4:
Chamber type: STD body
Chamber process: TI
RF generator / DC power supply 1: -
RF generator / DC power supply 2: -
RF generator / DC power supply 3: -
Turbo / cryo pump type: CTI OB-8F
1999 vintage.
AKT/AMAT / APPLIED MATERIALS / AKT Endura 5500 Reactor is a high-performance, multi-chamber deposition equipment used for semiconductor device fabrication. It is capable of performing a broad range of process applications with various substrates, including oxide, nitride, and metal deposition. AKT Endura 5500 provides highly-precise control for thickness uniformity, feature conformality, and advanced layer-to-layer steps for leading-edge device fabrication. AMAT ENDURA 5500 features an advanced vacuum system and a highly efficient re-circulated chemical delivery unit to minimize both overall operating costs and environmental impact through improved energy efficiency, uniformity, reduce machine pressure, and eliminate harmful gaseous by-products. It is also capable of providing a temperature-controlled substrate delivery tool with a wide range of parameters for advanced wafer process control. ENDURA 5500 chamber design utilizes a circular geometry to optimize process parameters such as uniformity, temperature, and pressure. Its advanced gas split-control enables the delivery of one or two separate solid, liquid, or gaseous reagents efficiently and with uniformity. The asset also offers an advanced thermal flood-cooling process for efficient, low-emission process control, and a wide range of injector designs to accommodate a wide range of process conditions and requirements. APPLIED MATERIALS ENDURA 5500 offers an intuitive graphical user interface to quickly define and manage process recipes and utilize the model's multi-chamber parameters. A wide range of APIs are available for integration with process monitoring and tracking during development and validation stages of production. The advanced process control algorithms used in the equipment ensure accurate production and high yield results. Endura 5500 provides superior reliability and performance, performing up to 40 simultaneous process steps in a single system. Its advanced materials compatibility, process versatility, and flexible, high-performance can meet the industry's most stringent demands. The unit is designed for scalability and operates with a wide range of precursors, allowing for easy product expansion and increased process throughput.
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