Used AMAT / APPLIED MATERIALS Centura 5200 DxZ #9206456 for sale

Name: AMAT / APPLIED MATERIALS Centura 5200 DxZ
Brand: AMAT / APPLIED MATERIALS
SKU: 9206456
Availability: SoldOut

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Reactors

Manufacturer

AMAT / APPLIED MATERIALS

Model

Centura 5200 DxZ

ID: 9206456

Wafer Size: 8"

CVD System, 8" Chamber A: DXZ SiN Clean method: RF Frequency: Single HF only Throttle valve type: Dual spring Manometer: Dual 10/100 Torr Chamber B: DXZ SiN Clean method: RF Frequency: Single HF only Throttle valve type: Dual spring Manometer: Dual 10/100 Torr Chamber C: DXZ SiN Clean method: RF Frequency: Single HF only Throttle valve type: Dual spring Manometer: Dual 10/100 Torr Chamber E: MS Cool Mainframe: System placement: Through the wall Robot type: HEWLETT-PACKARD Robot Robot blade: Nickel coated AL OTF: Yes W/F Position sensor: Yes Loadlock: Loadlock cassette: Narrow Wafer slide sensor: Yes Wafer mapping: Basic N2 Purge type: TYLAN 2900 System monitor: 1st Monitor: Through the wall 2nd Monitor: Stand alone Generator rack: (3) Racks Generator 1: AE RFG 2000-2V Generator 2: AE RFG 2000-2V Generator 3: AE RFG 2000-2V Heat exchanger: APPLIED MATERIALS, AMATO Chiller: No Dry pumps: No Signal tower: No Umbilicals: Monitor: 55 ft Signal cable length (S/C ~ MF): 50 ft HX Cable length: 55 ft Gas delivery option: MFC Type: STEC 4400 MC Valves: Veriflo 10 ra max Filters: MILLIPORE Transducers: MKS W/O Display Regulators: Veriflo Single line drop (SLD): No System cabinet exhaust: Top System controller: Slot Rack BD 2 System Reset 3 Lk Det 1 &2 or Conv/TC 4 Lk Det 3&4 or Conv/TC 5 Lk Det 5&6 or Conv/TC 6 Lk Det 7&8 or Conv/TC 9 EWOB Centerfinder 12 Floppy disk drive 13 Hard disk drive 14 Chamber A interface 15 Chamber B interface 16 Chamber C interface 17 Chamber D interface 18 Chamber E interface 19 Mainframe interface 20 Loadlock interface 22 Chamber A Dl/O 2 23 Chamber B Dl/O 1 24 Chamber B Dl/O 2 25 Chamber C Dl/O 1 26 Chamber C Dl/O 2 29 Chamber E Dl/O 30 Synergy SBC(V440) 32 Video 33 I/O Expansion 34 SEI 35 Chamber A Al/O 36 Chamber B Al/O 37 Chamber C Al/O 39 Mainframe Al/O 1 40 Chamber E/MF Al/O 2 41 Mainframe Dl/O 1 42 Mainframe Dl/O 2 43 Mainframe Dl/O 3 44 Mainframe Dl/O 4 45 Mainframe Dl/O 5 46 Mainframe Dl/O 6 47 Stepper 1 48 Stepper 2 49 Stepper 3 50 OMS (VMEX) RF Generator: Chamber Maker Model A AE RFG 2000-2V 3155053-003B B AE RFG 2000-2V 3155053-003B C AE RFG 2000-2V 3155053-003B RF Match box: Match multifunctional ADPTR With interlock 7-J14 OHM Chamber Maker Model A AE 155077-003B B AE 315S077-C03A C AE 315S077-C03A Power: 200/208 V, 240 A.

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AMAT / APPLIED MATERIALS Centura 5200 DxZ is a high-performance, multi-processing plasma enhanced chemical vapor deposition (PECVD) reactor—a device used in the production of advanced materials within the semiconductor, display, and photovoltaic industries. This tool is designed to allow customers to address a wide range of materials processing challenges with a single system—for example, high productivity oxide layers, deposition of PECVD a-Si materials for PERL applications, as well as ultra-thin layer deposition on large diameter substrates. It offers superior feature control in three dimensions, providing precise control of critical component topology. AMAT Centura 5200 DxZ is equipped with some of the most advanced chamber engineering available in the industry. It features a wafer substrate geometry capable of processing various size substrates up to 8" and comprised of a highly engineered pre-process chamber followed by a main (processing) chamber. In order to ensure uniformity and consistency during process operations, the chambers are temperature-controlled and closely monitored to ensure stable thermal conditions. APPLIED MATERIALS Centura 5200 DxZ is also equipped with a number of intuitive software packages that enable automated process control, real-time monitoring of temperatures, and programmable recipe creation. This allows for the optimization of tool efficiency and process consistency during production and helps reduce the cost of ownership. For increased throughput, Centura 5200 DxZ offers several advanced features including a dual-nozzle design, which allows for simultaneous processing of two substrates, and a dual-phase modulation process which can achieve higher deposition rates. The chamber design also includes advanced windowless evaporation technology, which helps to reduce the number of maintenance cycles, and further lower the cost of production over traditional approaches. Furthermore, AMAT / APPLIED MATERIALS Centura 5200 DxZ uses a highly efficient process gas delivery system which helps to reduce precursors and chemical usage, which aids in reducing the cost of materials and reducing the environmental impact. AMAT Centura 5200 DxZ is a highly advanced and versatile reactor, providing users with a state-of-the-art solution for producing advanced materials with exacting precision. Through its use of intuitive, highly-automated software and a variety of advanced features, it is capable of meeting the ever-changing needs of industries that rely on advanced materials processing.