Used AMAT / APPLIED MATERIALS Centura 5200 eMax #9183472 for sale

AMAT / APPLIED MATERIALS Centura 5200 eMax
ID: 9183472
Etcher, 8" Wafer shape: JMF SMIF Interface: No System information: Chamber A,B &C: eMax Chamber D & E: No Chamber F: Orientor Loadlock A & B: Narrow (6) Wafer sensors EPD Controller System placement: System alone Chamber details: Chamber A, B & C: RF Match: 0010-30686 RF Generator: OEM-28B ALCATEL ATH1600M Turbo pump Throttle valve Monometer: TYPE127 1TORR System monitor: Monitor 1: Stand alone Mainframe: Robot type: HEWLETT-PACKARD+ L/L Wafer mapping Slit valve / Plate type: Standard Robot blade: Ceramic W/F Slippage sensor N2 Purge Heat exchanger: No Dry pumps: No Signal tower: No Gas panel configuration: Chamber A, B & C: (7) Chambers Chamber A: CL2 100 sccm SEC-4400M CF4 100 sccm TYLAN 2900 N2 100 sccm SEC-4400 AR 300 sccm SEC-4400M O2 5 slm SEC-4400M CHF3 20 sccm SEC-4400M CF4 100 sccm SEC-4400M Chamber B: C4F8 50 sccm SEC-7440MC CO 500 sccm SEC-7440MC N2 100 sccm SEC-4400 AR 200 sccm SEC-4400M O2 50 sccm SEC-4400M CHF3 100 sccm SEC-4400M CF4 50 sccm SEC-4400M Chamber C: CL2 100 sccm SEC-7440MC CHF3 50 sccm TYLAN 2900 N2 100 sccm SEC-4400 AR 2 slm SEC-4400M O2 5 slm SEC-4400M CHF3 20 sccm SEC-4400M CF4 50 sccm SEC-4400M Missing parts: (2) Slit valves (3) Flow sensors / Coolant lines EDP Monitor Liner for chamber B Power: 208 VAC, 50/60 Hz, 4 Wire, 3 Phase delta 1996 vintage.
AMAT / APPLIED MATERIALS Centura 5200 eMax is a highly advanced integrated E-beam wafer processing reactor system capable of multi-layer photoresist deposition and removal. It is an optimal platform for advanced semiconductor device fabrication, biosensor development, and nanostructure creation. AMAT Centura 5200 eMax uses electron beam (e-beam) lithography for photoresist deposition and removal with beam current levels ranging from 5 nA to 200 mA. The e-beam runs along a circular axis and creates an electric field that is used to evaporate a resist layer into the substrate. APPLIED MATERIALS Centura 5200 eMax features a multi-user interface, enabling users to simultaneously conduct multiple processing steps. The system provides a controlled atmosphere for both resist deposition and removal, as well as temperature, pressure, and gas/humidity control capabilities that are customizable to the species utilized for the application. Centura 5200 eMax has a maximum maximum filament temperature of 2500oC, and with a vacuum of 1E-7 Torr and an 8" substrate size, it is advantageous for applications involving aluminum interconnect and deep trench technology. Additional features of the system include advanced coding automation and recipe management for improved process repeatability and performance. Moreover, the closed-loop imaging and alignment capabilities of AMAT / APPLIED MATERIALS Centura 5200 eMax optimize throughput and ensure reliable operation without the need for manual intervention. Additionally, the comprehensive process monitor allows for real-time data collection and statistical analysis of multiple lithography steps. AMAT Centura 5200 eMax operates with extremely high precision and offers a plethora of options for customization and optimization. Its ability to process a variety of electron beam exposure services, as well as multi-layer photoresist deposition and removal, make it an ideal solution for advanced wafer processing.
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