Used AMAT / APPLIED MATERIALS Centura 5200 eMax #9183472 for sale
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ID: 9183472
Etcher, 8"
Wafer shape: JMF
SMIF Interface: No
System information:
Chamber A,B &C: eMax
Chamber D & E: No
Chamber F: Orientor
Loadlock A & B: Narrow
(6) Wafer sensors
EPD Controller
System placement: System alone
Chamber details:
Chamber A, B & C:
RF Match: 0010-30686
RF Generator: OEM-28B
ALCATEL ATH1600M Turbo pump
Throttle valve
Monometer: TYPE127 1TORR
System monitor:
Monitor 1: Stand alone
Mainframe:
Robot type: HEWLETT-PACKARD+
L/L Wafer mapping
Slit valve / Plate type: Standard
Robot blade: Ceramic
W/F Slippage sensor
N2 Purge
Heat exchanger: No
Dry pumps: No
Signal tower: No
Gas panel configuration:
Chamber A, B & C: (7) Chambers
Chamber A:
CL2 100 sccm SEC-4400M
CF4 100 sccm TYLAN 2900
N2 100 sccm SEC-4400
AR 300 sccm SEC-4400M
O2 5 slm SEC-4400M
CHF3 20 sccm SEC-4400M
CF4 100 sccm SEC-4400M
Chamber B:
C4F8 50 sccm SEC-7440MC
CO 500 sccm SEC-7440MC
N2 100 sccm SEC-4400
AR 200 sccm SEC-4400M
O2 50 sccm SEC-4400M
CHF3 100 sccm SEC-4400M
CF4 50 sccm SEC-4400M
Chamber C:
CL2 100 sccm SEC-7440MC
CHF3 50 sccm TYLAN 2900
N2 100 sccm SEC-4400
AR 2 slm SEC-4400M
O2 5 slm SEC-4400M
CHF3 20 sccm SEC-4400M
CF4 50 sccm SEC-4400M
Missing parts:
(2) Slit valves
(3) Flow sensors / Coolant lines
EDP Monitor
Liner for chamber B
Power: 208 VAC, 50/60 Hz, 4 Wire, 3 Phase delta
1996 vintage.
AMAT / APPLIED MATERIALS Centura 5200 eMax is a highly advanced integrated E-beam wafer processing reactor system capable of multi-layer photoresist deposition and removal. It is an optimal platform for advanced semiconductor device fabrication, biosensor development, and nanostructure creation. AMAT Centura 5200 eMax uses electron beam (e-beam) lithography for photoresist deposition and removal with beam current levels ranging from 5 nA to 200 mA. The e-beam runs along a circular axis and creates an electric field that is used to evaporate a resist layer into the substrate. APPLIED MATERIALS Centura 5200 eMax features a multi-user interface, enabling users to simultaneously conduct multiple processing steps. The system provides a controlled atmosphere for both resist deposition and removal, as well as temperature, pressure, and gas/humidity control capabilities that are customizable to the species utilized for the application. Centura 5200 eMax has a maximum maximum filament temperature of 2500oC, and with a vacuum of 1E-7 Torr and an 8" substrate size, it is advantageous for applications involving aluminum interconnect and deep trench technology. Additional features of the system include advanced coding automation and recipe management for improved process repeatability and performance. Moreover, the closed-loop imaging and alignment capabilities of AMAT / APPLIED MATERIALS Centura 5200 eMax optimize throughput and ensure reliable operation without the need for manual intervention. Additionally, the comprehensive process monitor allows for real-time data collection and statistical analysis of multiple lithography steps. AMAT Centura 5200 eMax operates with extremely high precision and offers a plethora of options for customization and optimization. Its ability to process a variety of electron beam exposure services, as well as multi-layer photoresist deposition and removal, make it an ideal solution for advanced wafer processing.
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