Used AMAT / APPLIED MATERIALS Centura 5200 Epi #164775 for sale

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ID: 164775
Reactor ATM 2 Chamber configuration AC Rack: 3 Phase, 208 V, 400 A CB1 Trip unit: 500 A GFCI option: Yes Water leak detect option: Yes AccuSETT controller: Yes (3 channel) 5 Phase controller: Yes Loadlock: Type: Narrow body Wafer mapping: Yes Wafer slide detect option: Yes Baratron: MKS Transfer chamber: Robot type: HP Center finder: OTF Slit valve plate: Insert O-ring type Col down chamber: Yes (#F position only) Robot blade: Quartz Process chamber (2 Chambers): Chamber typeL: EPI ATM Susceptor: 0200-01932 Pre heat ring: 0200-35081 Susceptor support shaft: 0200-00412 Wafer lift shaft: 0200-00412 Upper dome: 0200-35084 Lower dome: 0200-35042 Temp pyrometer: (3ea) with AUX Baratron: 1000 Torr AMV: (2ea) Inner/outer Blower type: VSB Blower motor: Baldor Gas panel: MFC Unit 1660 ETC: Umbilical cable: 55 Ft Transformer: TR: 480/208V, 130 kVA 2000 vintage.
AMAT / APPLIED MATERIALS Centura 5200 Epi is an advanced plasma-enhanced deposition equipment. It is a batch-type reactor, commonly used to deposit advanced materials such as silicon, germanium, and silicon-germanium hetero-structures for integrated circuit manufacture. AMAT Centura 5200 Epi features an industry-leading both vertical and horizontal substrate configuration, allowing for the highest level of scalability and flexibility in production. APPLIED MATERIALS Centura 5200 Epi is powered by two hybrid inductively coupled plasma sources that deliver a highly uniform low-pressure deposition. It is equipped with Endura Ion Energy Shaping III (IES III), a proprietary technology that enables precise surface self-limiting control and layer-by-layer deposition uniformity. These layers consist of high-performance dielectric and metallization layers. The centrifugal gas injector (CGI) and end-of-run cooling system are designed to allow for rapid cooling and recycling in order to maximize cycle times. The CGI allows for quick, precise, and repeatable introduction of main process gases into the reactor. This increases the efficiency of the deposition chamber by maintaining the thermal balance. The apparatus also features a remote end-of-run cooling profile, allowing the chamber to quickly reach a safe temperature before switching to an inert atmosphere. This ensures maximum cycle times and particle control through rapid cooling of the process chamber. Centura 5200 Epi also features a software suite of process recipes and exacting control technologies. The unit can be configured for high-temperature, high-rate deposition for higher throughput applications. Additionally, the built-in non-contact wafer temperature measurement machine provides quick, accurate in-situ temperature measurement for process control. Overall, AMAT / APPLIED MATERIALS Centura 5200 Epi is the perfect tool for high-precision, highly reliable production processes. Its unique combination of features allows it to deliver the highest level of materials deposition uniformity and scalability demanded by the semiconductor industry.
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