Used AMAT / APPLIED MATERIALS Centura 5200 PVD #9036839 for sale

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ID: 9036839
Wafer Size: 8"
PVD Sputter System, 6" Chamber type: Position B: AL Standard body, 12.9" Source Position F: (1) CH & Standard orienter degas Wafer type: SNNF Type As-is.
AMAT / APPLIED MATERIALS Centura 5200 PVD (Physical Vapor Deposition) reactor is a powerful and precise tool designed for advanced process development. This industrial-grade deposition equipment offers state of the art technology that can provide high-purity, high-performance deposits for the production of thin-film materials used in a variety of applications. The system is capable of epitaxial, amorphous, and polycrystalline deposition with excellent uniformity and reliability and features a self-contained environment with an efficient energy transmission and low background chamber noise. The overall design of AMAT Centura 5200 PVD reactor includes an enclosed front-loading chamber that is sealed to prevent ingress of external contaminants. Inside the reaction chamber is a stable environment that helps maintain temperature homogeneity at a low level and simultaneously affords uniform delivery of power to multiple, independent, process gases needed for a successful deposition operation. Furthermore, the front-loading chamber is accessible and designed for quick, safe, and convenient sample loading and unloading. Key components of APPLIED MATERIALS Centura 5200 PVD reactor include a multi-zone quartz RF substrate holder which allows the user to adjust the residence time and flow profile of the process gases. It also has the capability to effectively disperse substrates for uniform deposition. The reactor also comes with multiple showerhead assemblies, which allow for an even distribution of process gases and better control over the deposition uniformity. Additionally, the 5200 PVD reactor provides temperature control and cooling capabilities for efficient heat removal in order to maintain a stable and low-temperature environment. The integrated robot-based part handling unit ensures a clean and efficient process by providing an automated sample handling operation. In conclusion, Centura 5200 PVD (Physical Vapor Deposition) reactor is a high-performance machine that offers superior results for thin-film layer deposition applications. It provides excellent uniformity, control, and stability, and its innovative design lowers process complexity and eliminates the need for frequent maintenance. This reliable, efficient, and versatile tool is the perfect solution for advanced process development.
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