Used AMAT / APPLIED MATERIALS Centura 5200 Ultima TE #293768621 for sale

AMAT / APPLIED MATERIALS Centura 5200 Ultima TE is a highly advanced plasma-based reactor for high-performance materials deposition. This reactor is capable of producing high-quality films for a range of technological applications. It provides a wide array of features that sets it apart from traditional high-pressure chemical deposition (HPCD) systems. The 5200 Ultima TE incorporates a high-efficiency plasma source that allows for superior film quality deposits. This is due to the high densities of ions and charged particles in the applied plasma which ensure uniform wafer-to-wafer deposition. Additionally, the reactor has an RF ion source which enables maximum deposition rates and precise control of film deposition rate and uniformity. The 5200 Ultima TE also utilizes advanced low-noise RF matching that helps reduce thermal and RF leakage disturbances in adjacent chambers. This not only grants superior film quality but increases plane-of-wafer uniformity. Additionally, the reactor boasts low-emission-cooling technologies which reduce deposition stresses, resulting in superior substrate and film quality. The 5200 Ultima TE also features a multi-gas plasma-enhanced chemical vapor deposition (PECVD) system. This system allows for high quality deposition of both silicon oxide and silicon nitride films. The software used in the reactor also offers stabilization and tuning capabilities for the various gases and process parameters, allowing for high uniformity films. Furthermore, this system also enables advanced wafer-to-wafer control, allowing for minimization of any edge-to-edge differences. The 5200 Ultima TE supports a multi-width processing capability that grants parallel processing capabilities. This reduces wafer processing time significantly by holding up to 320 watts of power and achieving up to 5,000 wafers/hour. Overall, AMAT Centura 5200 Ultima TE is a state-of-the-art plasma-based reactor designed for high-performance materials deposition and processing. The reactor can be used for a variety of advanced processes such as PECVD, enhanced etching, and optimized vacuum processing. The reactor offers an extensive suite of features and technologies that leverage high-efficiency plasma operation for superior film quality and uniformity.