Used AMAT / APPLIED MATERIALS Centura 5200 #9262487 for sale

AMAT / APPLIED MATERIALS Centura 5200 is a chemical vapor deposition (CVD) reactor designed for advanced electronics semiconductor manufacturing. It is used to deposit complex thin films on substrates such as silicon, aluminum, glass, and steel. The reactor utilizes DC and RF plasma sources for etching, depositing, and cleaning. AMAT Centura 5200 is particularly useful for the deposition of III-V and II-VI compound thin films, due to its specialized hybrid type susceptor configuration combined with a dual-source plasma equipment. This unique combination provides the users with extraordinary uniformity, even over very large runs. Additionally, the DC source has exceptional uniformity and repeatability. The large capacity and high processing speed of APPLIED MATERIALS Centura 5200 is made possible through its patented, vertical, in-situ control of reactant flow. This enables the user to optimize the process on a wafer-by-wafer basis, creating a uniform and reproducible thin film. The system features a highly sensitive end-point detection unit for precise thin film deposition control, allowing for the deposition of thin films with excellent composition control, superior surface quality, and superior layer-to-layer uniformity. The machine also features a heated process chamber to prevent the formation of condensation on the surface of the substrates, providing users with a more precise, repeatable and long-term process control. Furthermore, the tool benefits from a low particle count and excellent process chamber cleanliness. This allows for the use of a larger range of wafer sizes and substrates, as well as a wider range of process steps and temperatures. Centura 5200 has a massive 23"/580mm wafer loading capacity, as well as a vacuum process chamber with a maximum pressure of 1x10-5 torr. Overall, AMAT / APPLIED MATERIALS Centura 5200 was designed to provide customers with advanced CVD technology and precise thin film deposition capabilities over the entire surface of the wafer. It performs consistently, day in and day out, with the highest level of reliability, repeatability and uniformity achievable for semiconductor production.