Used AMAT / APPLIED MATERIALS Centura ACP #9044357 for sale
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ID: 9044357
RP EPI system, 12"
Install Type: Through-the-wall (TTW)
Platform Type: 300mm Centura ACP
System Config:
FI/LPs
LLK-A (Batch Load)
LLK-B (Batch Load)
Ch-A: RP EPI
Ch-B: RP EPI
Ch-C: RP EPI
Ch-D: RP EPI
Cassette Interface:
Factory Interface (FI): rev 5.3+
(2) 300mm TDK FOUP Load-ports
Status Lamp: FI Mounted, Programmable, (R, Y, G, B)
Transfer Chamber Lid type : Solid (SS)
User Interface: System-side UI on Roll-around stand
Touch Screen
Keyboard/Mouse
System Software (SW) ver: ccB2.6_37
Power Requirements: 480/208VAC, 3-Phase
Chemical/Gases used: H2, DCS, HCL, N2
Remote Components: (2) AC Remote Panel, 480VAC
2006 vintage.
AMAT / APPLIED MATERIALS Centura ACP is a state-of-the-art deposition reactor designed for advanced semiconductor packaging applications. It is capable of delivering high-performance, low-cost, and high-yield results for a variety of materials, such as polymers, oxides, and organics. AMAT Centura ACP is designed for advanced semiconductor packaging and features a modular design for customizing processes. It has an advanced variable deposition rate feature, allowing precise control of the thickness and uniformity of materials on substrates. The reactor also has a range of multi-mode features, such as a variable rotation system, allowing for multiple substrates to be processed at the same time. In combination with other processing features, the reactor has the capability to produce complex, three-dimensional structures with multiple layers. APPLIED MATERIALS Centura ACP is equipped with a number of advanced features to ensure precise control of the deposition rate and uniformity of films. It has a high-resolution projection optics system, allowing for accurate alignment and monitoring of the deposition parameters. It also features a controllable nozzle positioner that allows for precision movement of the process chamber during the deposition process. Centura ACP is compatible with a range of high-performance feedgas chemistries, from silanes to hydrogen silsesquioxanes (HSQ). The reactor is able to process a wide variety of materials, including resist materials, film adhesives, and metals, as well as silicon and MEMS devices. AMAT / APPLIED MATERIALS Centura ACP is designed with environmental requirements in mind, ensuring low levels of particulates, while still providing high-yield, high-performance results. It is designed for scalability and works with other equipment, such as batch systems and closed-loop systems. AMAT Centura ACP's modular design and features allow it to deliver consistent, high-caliber results for advanced semiconductor packaging applications. Its range of multi-mode features makes it ideal for high-production runs and custom processes. With its advanced capabilities for precise control and high-yield results, APPLIED MATERIALS Centura ACP is an ideal choice for any advanced semiconductor packaging needs.
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