Used AMAT / APPLIED MATERIALS Centura AP DPS II Polysilicon #9208337 for sale

AMAT / APPLIED MATERIALS Centura AP DPS II Polysilicon Reactor is an advanced production equipment designed for producing high purity polysilicon for the semiconductor industry. This sophisticated system utilizes three distinct process executions—argon plasma doping (APD), charge floating layer (CFL) and silicon implantation (SI)—to achieve an optimal level of purity in the produced polysilicon. The APD process utilizes argon plasma doping technology, which introduces arsenic or phosphorus dopants into the surface of the polysilicon wafer, allowing for changes in conductivity and precise control over the material's electronic properties. The CFL process utilizes a floating charge layer (FCL) to regulate dopant movement, providing flexibility in dopant selection and improved process control. Finally, the SI process utilizes an ion implantation process to introduce a unique substrate surface into a polysilicon wafer, providing accurate control over its electrical properties and improved wafer quality. AMAT Centura AP DPS II Polysilicon Reactor is designed to enable a high-speed, multi-chamber approach to producing polysilicon, allowing for simultaneous processing of up to six full-size every hour. This makes it ideal for large-scale production requirements. With its customization capability, users can configure the unit to create a variety of output specifications, such as as-grown carrier concentrations, rapid thermal annealing (RTA), and polysilicon deposition. This allows for further accelerated processing times. The machine is integrated with six key components: 1) a gas delivery tool; 2) a vacuum asset; 3) a contamination control model; 4) a process chamber; 5) an electronics unit, and 6) a micro-laminating equipment. The gas delivery system ensures that all necessary gases and dopants are supplied in a safe and efficient manner. The vacuum unit removes any volatile contaminants from the environment and controls the machine's pressure. The contamination control tool includes advanced scrubbing technology for purifying the environment before and after each procedure. The process chamber is designed to keep substances at the required temperature and pressure levels, as well as providing a truly clean environment. The electronics unit monitors and records all asset operations, as well as providing a variety of model control features. Finally, the micro-lamination equipment allows for accurate material deposition and control. In summary, APPLIED MATERIALS Centura AP DPS II Polysilicon Reactor is an advanced production system for the semiconductor industry. It utilizes three distinct process executions—argon plasma doping (APD), charge floating layer (CFL) and silicon implantation (SI)—to achieve an optimal level of purity of the produced polysilicon. The unit is capable of producing up to six full-size wafers per hour, and can be customized for a variety of wafer specifications. The machine is further integrated with six key components—a gas delivery tool, vacuum asset, contamination control model, process chamber, electronics unit, and micro-laminating equipment—for achieving the highest levels of quality and efficiency.