Used AMAT / APPLIED MATERIALS Centura AP Enabler #9027457 for sale
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ID: 9027457
Wafer Size: 12"
Vintage: 2007
Dielectric etcher, 12"
Process: Cu 62L, 65L, & 92L
Software version: B2.6_45
System Power Rating: 208 AC 3-Phase for system
Loading configuration: 3
Ch-A: Etch chamber 1
Gases used: C4F6/CH2F2/C3F8/CF4/O2/N2/AR/C4F8
Ch-B: Etch Chamber 2
Gases used: C4F6/CH2F2/C3F8/CF4/O2/N2/AR/C4F8
Ch-C: Etch Chamber 3
Gases used: C4F6/CH2F2/C3F8/CF4/O2/N2/AR/C4F8
Ch-D: Etch Chamber 4
Gases used: C4F6/CH2F2/C3F8/CF4/O2/N2/AR/C4F8
Ch-TC: Transform Chamber
Gases used: N2 (venting)
2007 vintage.
AMAT / APPLIED MATERIALS Centura AP Enabler is a high-temperature chemical vapor deposition (CVD) reactor and a vacuum deposition chamber. It is designed to perform a wide range of applications from deposition of thin layers for semiconductor device metallization to low-temperature organic and even atomic layer deposition (ALD). It is well-suited for semiconductor device production in various industries, including memory, medical and MEMS device production. The AP Enabler is based on a cryogenic vacuum chamber which provides excellent uniformity and repeatability with a level of temperature stability unsurpassed by other industrial CVD reactors. The equipment has a 10-axis robotic arm with a high moving speed along with precise motion control to facilitate precise positioning during the deposition process, as well as allowing for the formation of patterned layers. The reactive gases used in the chamber are introduced through narrow tubes, minimizing potential contamination. The AP Enabler is also equipped with a data logging system that allows for detailed analysis of parameters like gas flow rate, pressure and temperature. The data logging unit also allows users to adjust process parameters like the deposition temperature and pressure in real time. Other machine features include a unique gas trail feature designed to automatically uncouple the reactive gases from the carrier gas before introducing them into the chamber, mitigating the risk of deposit contamination. The AP Enabler tool is a reliable, cost-effective solution that can easily be integrated with other processes to create custom configurations for specific applications. The asset is also capable of accommodating a number of wafers at once and can deliver near-perfect uniformity for high-speed device production. Furthermore, the AP Enabler is designed for easy maintenance, with robust components designed to prevent corrosion-related damage and simplify cleaning.
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