Used AMAT / APPLIED MATERIALS Centura AP Enabler #9282211 for sale

AMAT / APPLIED MATERIALS Centura AP Enabler is a multi-zone electron cyclotron resonance (ECR) gas-based etch reactor. It is designed for silicon-based applications such as thin-film transistors and metal-oxide-semiconductor (MOS) devices. It features a unique, internally cooled and biased source module that allows for fabrication of high-aspect-ratio features, enabling a greater range of fabrication capabilities. The Enabler is also capable of achieving a cost-effective range of process conditions and exhibit exceptional process-uniformity over an entire wafer. The AP Enabler operates in a constant-power mode, offering high plasma density and repeatable recipes. The ECR plasma source provides energetic species to deposit and etch with high precision and repeatability, enabling superior etch uniformity and feature resolution. The plasma source is enclosed within a radiation-shielded chamber and operated at exceedingly low pressure (10-5 mbar). The ECR source is composed of three spiral resonances - 24GHz, 40GHz and 60GHz - with each spiral serving a distinct purpose. It is also outfitted with a unique magnet equipment that enables full control of plasma-density modulation throughout the wafer for greater feature uniformity and repeatability. The Enabler reactor is built on AMAT Centura platform and incorporates high-throughput and dual-chamber design that allows for process sequence optimization. The two chambers consist of the process chamber and the loadlock chamber. The process chamber contains the single-wafer cooling shield, which allows for cool-down and pre-conditioning of the reactors prior to etch and deposition. The loadlock chamber is used for substrate transfer to and from the process chamber, eliminating the need for a dedicated vacuum system for loading and unloading. The Enabler is capable of performing both inorganic and organic etching processes with multi-zone processing. It offers precise control over etch rates by using multiple zone boundary parameters such as chamber pressure, cooling flow rate, and gas composition. This allows for special recipes and processes to be tailored to suit different etching needs. It also features an enhanced thermal-management unit for more accurate, reliable, and repeatable performance. The AP Enabler is optimized for production-scale analysis and offers integrated end-point detection with advanced process control. The machine's data-collection capabilities and advanced analytics enable repeatable process recipes, improved etch yields, and process traceability. All of these features enable the Enabler to meet high-yield requirements for advanced applications in semiconductor fabs.