Used AMAT / APPLIED MATERIALS Centura AP Ultima X #9162819 for sale

It looks like this item has already been sold. Check similar products below or contact us and our experienced team will find it for you.

ID: 9162819
Wafer Size: 12"
Vintage: 2005
HDP-CVD System, 12" System SW Rev.: 3.7_31 Factory interface (FI) (2) 12" FOUP Load-ports Enhanced 25-slot FOUP support 8-Slot wafer Pass-Thru / Storage Hermos with RF E99 carrier ID Upper E84 sensors & cables Overhead transport WIP delivery system (OHT) Wafer handling robots: (2) Kawasaki with Edge Grip Pre-Aligner (Single axis) Status lamp (DeviceNet, Color configurable, Left-Side pole mounted) Light curtain Front facing intake plenum Mini-Environment with automatic pressure control 12" Centura AP M/F: Robot: VHP (Std Reach ver) Robot blade type: Conductive alumina Clear Lid Process chamber isolation: Dual pressure VAT Bellows 336 Al slit valve inserts Umbilicals: Heat exchanger: 65ft Heat exchanger hoses: 50ft Pump: 65ft Facility connections: AP Front, Thru-the-floor System safety: M/F AC Dist. Box with LOTO CBs Std INTLK system EMO Push turn to release User interface: UI-1: Roll-Around stand, Flat panel / Keyboard UI-2: Thru-the-Wall, Flat panel Chambers: LLKA: SWLL (Cool down only) LLKB: SWLL (Cool down only) A: Ultima X HDP-CVD (Z7) B: Ultima X HDP-CVD (Z7) D: Ultima X HDP-CVD (Z7) Load locks: Type: SWLL (AP ver) Cool-Down enabled Door type: AP Std Lid type: Std viewport Lid VAT Bellows 336 Al slit valve inserts Process chambers: Ch-A / B / D: Ultima X HDP-CVD (Z7) IR Diagnostic (01) Oxide ¡V USG STI with He / H2 Astron RPS MKS (ENI) Spectrum power supplies Turbo pump: Shimadzu H3603L Turbo CNTRL: Shimadzu Gas box config: Gas panel feed: Bottom Exhaust: Bottom MFCs: Unit 8565C Valve type: Veriflo Filter type: Millipore Controller type: DeviceNet Gas lines (Ch-A/B/D): #1: N2 (pure), #2: O2 (pure), #3: H2 (pure), #4: SiH4, #5: He (pure), #6: He (pure) #7: Ar (pure), #8: SiH4, #9: O2 (pure), #10: NF3, #11: NF3, #12: N2 (pure) Heat exchanger / Chiller: (2) SMC Heat exchanger Pumps: Txfr: (1) Alcatel A100L iPUP Alcatel pump interface box (2) Equipment racks (Ultima version) (1) AC Rack Facilities UPS Interface Power requirements: 200/208VAC, 3-Phase, 400A, 4-Wire, Freq 60Hz Primary 400A Drop for 1-2 Process chamber support Options: Hynix specific configured FI status lamp Power vaccine (1s power off time delay) CE-Marked 2005 vintage.
AMAT / APPLIED MATERIALS Centura AP Ultima X is a high-performance deposition tool designed for rapid and precise deposition of metallic and dielectric films in semiconductor and microelectronics fabrication. This equipment provides superior "best-in-class" performance for a range of advanced process technologies, including dielectric deposition and metal deposition, to meet challenging device requirements. AMAT Centura AP Ultima X is equipped with the latest features, including a fully automated wafer transfer system, advanced software control features, high-accuracy pressure control technology, and automated cleaning and maintenance capabilities. The unit is powered by an advanced high-capacity plasma source capable of providing short deposition cycles and consistent results for the most challenging deposition processes. The Ultima X's precision motion systems allow the machine to precisely position the wafer for greater throughput and repeatability, while its automated contour wafer and edge-bias assurance (CBEA) feature ensures that the film adheres to the substrate properly and uniformly. Its advanced pumping systems ensure that process gases remain stable and within the required range of concentrations. The precision gas delivery tool of the Ultima X also helps reduce contamination. In terms of deposition uniformity, APPLIED MATERIALS Centura AP Ultima X provides excellent performance with a uniformity better than +/- 5%. The uniformity results achieved with the Ultima X have been confirmed by several independent third-party studies. Moreover, the Ultima X's superior chamber design reduces the possibility of damage to the wafer due to sidewall sputtering and contamination from airborne particles. This makes Centura AP Ultima X an ideal choice for deposition processes requiring high accuracy and precision. In addition, the asset's advanced in-situ cleaning capabilities help maintain a high-quality of deposition with consistent wafer-to-wafer uniformity. The model also offers automation for substrate and wafer handling, including the ability to adjust and set pressure and temperature profiles from the main control console. The Ultima X also features an intuitive user interface that provides a clear view of the process parameters and diagnostics. Overall, AMAT / APPLIED MATERIALS Centura AP Ultima X is an advanced, user-friendly deposition equipment with superior uniformity, throughput, and stability. The system provides a cost-effective solution for a range of advanced process requirements, from high-performing dielectric and metal depositions, to high-accuracy and repeatable processes. This unit's capabilities make it the ideal choice for semiconductor, microelectronics fabrication, and other industries requiring high-quality, reliable deposition processes.
There are no reviews yet