Used AMAT / APPLIED MATERIALS Centura AP Ultima X #9162819 for sale
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ID: 9162819
Wafer Size: 12"
Vintage: 2005
HDP-CVD System, 12"
System SW Rev.: 3.7_31
Factory interface (FI)
(2) 12" FOUP Load-ports
Enhanced 25-slot FOUP support
8-Slot wafer Pass-Thru / Storage
Hermos with RF E99 carrier ID
Upper E84 sensors & cables
Overhead transport WIP delivery system (OHT)
Wafer handling robots: (2) Kawasaki with Edge Grip
Pre-Aligner (Single axis)
Status lamp (DeviceNet, Color configurable, Left-Side pole mounted)
Light curtain
Front facing intake plenum
Mini-Environment with automatic pressure control
12" Centura AP M/F:
Robot: VHP (Std Reach ver)
Robot blade type: Conductive alumina
Clear Lid
Process chamber isolation: Dual pressure VAT Bellows
336 Al slit valve inserts
Umbilicals:
Heat exchanger: 65ft
Heat exchanger hoses: 50ft
Pump: 65ft
Facility connections: AP Front, Thru-the-floor
System safety: M/F AC Dist. Box with LOTO CBs
Std INTLK system
EMO Push turn to release
User interface:
UI-1: Roll-Around stand, Flat panel / Keyboard
UI-2: Thru-the-Wall, Flat panel
Chambers:
LLKA: SWLL (Cool down only)
LLKB: SWLL (Cool down only)
A: Ultima X HDP-CVD (Z7)
B: Ultima X HDP-CVD (Z7)
D: Ultima X HDP-CVD (Z7)
Load locks:
Type: SWLL (AP ver)
Cool-Down enabled
Door type: AP Std
Lid type: Std viewport Lid
VAT Bellows
336 Al slit valve inserts
Process chambers:
Ch-A / B / D: Ultima X HDP-CVD (Z7)
IR Diagnostic
(01) Oxide ¡V USG STI with He / H2
Astron RPS
MKS (ENI) Spectrum power supplies
Turbo pump: Shimadzu H3603L
Turbo CNTRL: Shimadzu
Gas box config:
Gas panel feed: Bottom
Exhaust: Bottom
MFCs: Unit 8565C
Valve type: Veriflo
Filter type: Millipore
Controller type: DeviceNet
Gas lines (Ch-A/B/D):
#1: N2 (pure), #2: O2 (pure), #3: H2 (pure), #4: SiH4, #5: He (pure), #6: He (pure)
#7: Ar (pure), #8: SiH4, #9: O2 (pure), #10: NF3, #11: NF3, #12: N2 (pure)
Heat exchanger / Chiller:
(2) SMC Heat exchanger
Pumps:
Txfr: (1) Alcatel A100L iPUP
Alcatel pump interface box
(2) Equipment racks (Ultima version)
(1) AC Rack
Facilities UPS Interface
Power requirements: 200/208VAC, 3-Phase, 400A, 4-Wire, Freq 60Hz
Primary 400A Drop for 1-2 Process chamber support
Options:
Hynix specific configured FI status lamp
Power vaccine (1s power off time delay)
CE-Marked
2005 vintage.
AMAT / APPLIED MATERIALS Centura AP Ultima X is a high-performance deposition tool designed for rapid and precise deposition of metallic and dielectric films in semiconductor and microelectronics fabrication. This equipment provides superior "best-in-class" performance for a range of advanced process technologies, including dielectric deposition and metal deposition, to meet challenging device requirements. AMAT Centura AP Ultima X is equipped with the latest features, including a fully automated wafer transfer system, advanced software control features, high-accuracy pressure control technology, and automated cleaning and maintenance capabilities. The unit is powered by an advanced high-capacity plasma source capable of providing short deposition cycles and consistent results for the most challenging deposition processes. The Ultima X's precision motion systems allow the machine to precisely position the wafer for greater throughput and repeatability, while its automated contour wafer and edge-bias assurance (CBEA) feature ensures that the film adheres to the substrate properly and uniformly. Its advanced pumping systems ensure that process gases remain stable and within the required range of concentrations. The precision gas delivery tool of the Ultima X also helps reduce contamination. In terms of deposition uniformity, APPLIED MATERIALS Centura AP Ultima X provides excellent performance with a uniformity better than +/- 5%. The uniformity results achieved with the Ultima X have been confirmed by several independent third-party studies. Moreover, the Ultima X's superior chamber design reduces the possibility of damage to the wafer due to sidewall sputtering and contamination from airborne particles. This makes Centura AP Ultima X an ideal choice for deposition processes requiring high accuracy and precision. In addition, the asset's advanced in-situ cleaning capabilities help maintain a high-quality of deposition with consistent wafer-to-wafer uniformity. The model also offers automation for substrate and wafer handling, including the ability to adjust and set pressure and temperature profiles from the main control console. The Ultima X also features an intuitive user interface that provides a clear view of the process parameters and diagnostics. Overall, AMAT / APPLIED MATERIALS Centura AP Ultima X is an advanced, user-friendly deposition equipment with superior uniformity, throughput, and stability. The system provides a cost-effective solution for a range of advanced process requirements, from high-performing dielectric and metal depositions, to high-accuracy and repeatable processes. This unit's capabilities make it the ideal choice for semiconductor, microelectronics fabrication, and other industries requiring high-quality, reliable deposition processes.
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