Used AMAT / APPLIED MATERIALS Centura AP Ultima X #9274497 for sale
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ID: 9274497
Wafer Size: 12"
Vintage: 2004
HDP CVD System, 12"
(3) Chambers
TMP
SHIMADZU
RPS
MKS
OS
Server type
2004 vintage.
AMAT / APPLIED MATERIALS Centura AP Ultima X is a low pressure, low temperature rapid thermal processing (RTP) reactor that is designed for applications such as annealing, doping, and light lithography. It is a closed-cycle thermal equipment that utilizes forced convective heat transfer to create repeatable and reliable processing results. The Ultima X provides temperature control from -60°C to 700°C with a maximum temperature ramp rate of 600°C/sec for rapid thermal cycling. The Ultima X features a chamber volume of 0.35 ft³ with a 100 mm diameter process tube capable of accommodating up to 33 substrates. The chamber features an easy to use, dual-seal door and an exhaust port for venting off processing byproducts. A horizontal chuck is also provided for substrate loading/unloading. The reactor is powered with individual vertical and horizontal heating elements as well as two xenon lamps for simultaneous vertical and horizontal irradiation. The unit is further equipped with an APIII Integrated Controllers, providing digital temperature control with a maximum heating/cooling rate of 1°C/sec. This controller is pre-programmed with 310 user-defined recipes to help streamline your process. The touchscreen interface provides an easy way to adjust the parameters for a given process. The controller also integrated with an infrared firing and vacuum control system and offers 50 database slots for parameter storage. The Ultima X provides a vacuum unit that offers a base vacuum level of 5 mTorr with optional booster pumps. The integrated vacuum gauge ensures accurate control and the forced exhaust outlet allows for venting of process gases. The machine is housed in an isolated stainless steel box for accurate and safe operation. The UV-A quartz far-infrared dual-wavelength radiation tool allows for efficient and repeatable thermal processing. The window allows for optimal transmission of the radiative energy from the lamps. The unit can be integrated with a Mass Flow Controller asset to allow for specific atmosphere processing. The fixed split exhaust tube ensures a homogeneous thermal state within the chamber while minimizing the temperature gradient. AMAT Centura AP Ultima X is the ideal low pressure, low temperature RTP reactor for light lithography and applications like annealing and doping. It offers a superior stainless-steel design, exceptional temperature control and accuracy, integrated vacuum model and atmosphere control, and split-exhaust to ensure homogeneous thermal cycles. This reactor can ensure repeatable and reliable processing results for most semiconductor processes.
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