Used AMAT / APPLIED MATERIALS Centura AP Ultima X #9293599 for sale

AMAT / APPLIED MATERIALS Centura AP Ultima X Reactor is an innovative chemical vapor deposition (CVD) equipment designed to provide ultra-precise control of the process environment. It uses low-pressure and low-temperature etching and deposition methods to deposit prototype semiconductor films, typically for manufacturing complex multi-layer structures and nano-scale devices. The Ultima X has exceptional reactivity and uniformity for higher throughputs and greater yields. The AP Ultima X Reactor is capable of producing films of up to five microns in thickness, while maintaining precise process control. The system's intelligent hardware and software design are engineered to optimize temperature, pressure, and gas flow, along with chemical precursors and reaction components to produce an ideal film structure. This advanced reactor unit features a large single-chamber design, which includes a four-zone vapor deposition machine. It allows up to four different precursors to be used simultaneously in their respective deposition zones. The Ultima X reactor also includes a load-lock tool for process control of the deposition, as well as a mechanical shutter and inerting technology. The advanced control asset provides real-time experiments and jogs, as well as comprehensive monitoring of the entire process. It is also equipped with a scanning electron microscope for high-precision measurements of film deposition thickness and uniformity. This feature enables simultaneous monitory of critical process parameters such as gas flow, temperature and pressure. The Ultima X's combustion flame can support gaussian distributed and otherwise isotropic flame properties. The reactor also features load locks and integrated mass flow controllers for loading into and out of the chamber. The Ultima X's dual-chamber model allows for the simultaneous deposition of two films in order to reduce process time and enhance overall efficiency. It also provides an advanced safety module for protection against overexposure of hazardous materials. In conclusion, AMAT Centura AP Ultima X Reactor is a highly versatile and efficient chemical vapor deposition equipment. With its advanced temperature, pressure, and gas flow control capabilities, it provides sophisticated films and nano-scale structures while also maintaining a high level of safety. Besides its high precision and quality, the reactor also offers a wide range of features and benefits that make it an attractive option for high volume, high quality production.