Used AMAT / APPLIED MATERIALS Centura AP Ultima X #9329246 for sale

AMAT / APPLIED MATERIALS Centura AP Ultima X is an advanced ultra-clean plasma reactor designed for the fabrication of new and advanced nanoscale integrated circuits. This plasma reactor employs unique design features which ensure that the highest levels of performance are achieved for both etching and deposition processes. This plasma reactor utilizes a radial uniformity cycling technology that automatically maintains the same etch feature size for the entire wafer despite the effects of temperature, pressure, and vacuum variations. Additionally, this plasma reactor offers an extremely fast startup time compared to other plasma reactors, allowing for quick process cycle times at a reduced cost. AMAT Centura AP Ultima X features a large 4-inch wafer surface area for optimum throughput and productivity, delivering etchsteps at up to 600mm/sec for high throughput requirements. The pressure boat design is optimized for superior wafer surface contact to maximize the etch uniformity over the entire surface of the wafer, ensuring that no etch hotspots are created. Additionally, this advanced design ensures that APPLIED MATERIALS Centura AP Ultima X is well-suited for etching of high aspect ratio structures with minimal bias applied to the wafer. Centura AP Ultima X plasma reactor also offers fully integrated automation/ programmability, allowing the user to adjust the etch process parameters precisely for any given application. This plasma reactor is also equipped with self-diagnostics and run/process monitoring to help ensure a more reliable, repeatable process. Furthermore, this system features advanced gas and plasma control systems which ensure the highest level of process repeatability and uniformity for excellent yield production. AMAT / APPLIED MATERIALS Centura AP Ultima X plasma reactor is an ideal solution for a wide range of integrated circuit etch and deposition applications, meeting the requirements of both industrial and R&D production. With its unique design features and integrated automation and process control systems, this advanced system provides the highest performance for both etching and deposition processes.