Used AMAT / APPLIED MATERIALS Centura AP Ultima X #9362141 for sale

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ID: 9362141
Wafer Size: 12"
Vintage: 2005
HDP CVD System, 12" Chamber A, B and C: Chamber type: Ultima X HDP CVD RF Source: 1.8-2.17 MHz (Maximum 10000 W) RF Bias: 13.56 MHz (Maximum 9500W) RF RPS: 400 kHz (Maximum 6000W) Gas configuration (SCCM): MFC Full scale Gases: Gas / Range O2 / 1000 SCCM NF3 / 100 SCCM HE / 600 SCCM SiH4 / 300 SCCM H2 / 1000 SCCM AR / 1000 SCCM H2 / 1000 SCCM SiH4 / 50 SCCM HE / 400 SCCM NF3 / 200 SCCM NF3 / 3000 SCCM AR / 3000 SCCM Does not include: Hard Disk Drive (HDD) 2005 vintage.
AMAT / APPLIED MATERIALS Centura AP Ultima X is a high-performance production tool designed for the fabrication of advanced semiconductor devices. It is an etch-processing tool that utilizes an inductively coupled plasma (ICP) source for anisotropic etching, auxiliary oxygen and fluorine sources, and a novel reactor chamber design for optimal etching conditions. The inductively coupled plasma source provides a highly uniform plasma and efficiently etches materials with isotropically etched features. The auxiliary oxygen and fluorine sources enable the etching of compounds and high-aspect-ratio features with a precision not attainable with traditional plasma-source tools. The reactor chamber is optimized for the lowest operating pressure and highest etch rates, and features an efficient cooling equipment to maintain optimal etching conditions throughout the process. AMAT Centura AP Ultima X is suitable for etching a wide range of materials including silicon, amorphous silicon, compound semiconductors, oxides, polysilicon, high-K dielectrics, and other materials. It can be set up to process dual wafers, allowing for simultaneous etching of different device stacks. A turbomolecular pumping system facilitates high operating pressure, further increasing the etch rate. The chamber is equipped with multiple sensors that monitor gas and temperature levels, allowing for precise etching parameters to be maintained. In terms of safety, APPLIED MATERIALS Centura AP Ultima X is designed with a built-in safety shutter and pressure sensor. The pressure sensors monitor the operating pressure to ensure that it remains within a safe range during each etching process. The pressure and temperature sensors also alert operators when the operating parameters reach or exceed the predetermined parameters, allowing the unit to be shut down in a safe and timely manner. To achieve high-yield, high-reliability results, Centura AP Ultima X is equipped with components and features designed specifically for etching precision-critical features and materials, as well as a library of pre-programmed process recipes that are optimized for each particular etching process. Furthermore, sophisticated data analysis and process diagnostics capabilities enable the machine to be monitored in real-time to ensure optimal etch performance and reliability. In summary, AMAT / APPLIED MATERIALS Centura AP Ultima X is an advanced, high-performance production tool designed for the fabrication of advanced semiconductor devices. It features an ICP source for high-precision etching, an optimized reactor chamber for maximum etch rate and pressure, and a suite of safety features to ensure a safe and reliable process. In addition, the tool is also equipped with a library of pre-programmed recipes and powerful data analysis and process diagnostics capabilities for increased efficiency.
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