Used AMAT / APPLIED MATERIALS Centura AP Ultima X #9397024 for sale

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ID: 9397024
Vintage: 2005
HDP CVD System No Hard Disk Drive Chamber A,B and C: Chamber type: Ultima X HDP CVD RF Source: 1.8-2.17 MHz (Maximum 10000 W) RF Bias: 13.56 MHz (Maximum 9500W) RF RPS: 400 kHz (Maximum 6000W) Gas config (SCCM): MFC Full scale Gases: Gas / Range O2 / 1000 SCCM NF3 / 100 SCCM HE / 600 SCCM SiH4 / 300 SCCM H2 / 1000 SCCM AR / 1000 SCCM H2 / 1000 SCCM SiH4 / 50 SCCM HE / 400 SCCM AR / 100 SCCM NF3 / 3000 SCCM AR / 3000 SCCM 2005 vintage.
AMAT / APPLIED MATERIALS Centura AP Ultima X is an innovative state-of-the-art reactor designed for etching, deposition, and other advanced-level semiconductor processing. It is a hot-wall, remote plasma source (RPS) reactor with a large chamber, wide range of process gases and extreme stability for critical applications. AMAT Centura AP Ultima X equipment is optimized to deliver high-performance etching and deposition processes, with remarkably uniform material uniformity and high-aspect ratio features. With its power and etch capability, it can etch and deposit across multiple layers and features faster than ever before. The reactor also offers superior uniformity control and production rate, as well as cleanliness control for advanced micro and nano structures. It also features a proprietary and uniquely designed enclosure door, enabling easy transition from ambient environment to process environment (PEC) and back again, as well as precise control of pressure, temperature, and other chamber parameters. The AP Ultima X also provides flexible chamber load/unload capability, which reduces downtime while increasing yield. The RPS reactor features advanced plasma, gas delivery, and cooling that ensure high precision and high-quality device performance. It has an automated gas delivery system which performs reactive-gas mass flow control in an effective and reliable manner, as well as a gas distribution unit to ensure uniform plasma generation. Additionally, this machine is equipped with an advanced gas distribution tool, allowing uniform coverage during deposition and etching. The AP Ultima X comes with a number of additional features, such as a tunable process window, advanced thermal control capabilities, and advanced diagnostics. It also provides users with multi-layer etching/deposition options and the ability to run multiple process Recipes as well as full-scale process control, all of which contribute to the high level of control available with the asset. Furthermore, the AP Ultima X features a scalable digital controller, which can be configured per model needs, allowing for greater flexibility in automation. APPLIED MATERIALS Centura AP Ultima X delivers exceptionally uniform etching, enabling fabrications of deep feature structures with clean surfaces and improved device performance. With its robust design and capabilities, it is the perfect solution for precision processing of advanced semiconductor devices.
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