Used AMAT / APPLIED MATERIALS Centura AP #114540 for sale
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ID: 114540
Metal Etch DPSII, 8"
Software Version - E1.5
Loadlock - Versaport
Wafer Passthru and Storage - 2 slots
Chamber A - DPS II
Chamber B - DPS II
Chamber C - ASP II
Chamber D - ASP II
Chamber F - Orientor
Chamber E - Cooldown
System Monitor - 1 remote / 1 thru-wall mount
Configurable Light Tower - Direct I/O Four Color Light Tower
Controller Facilities Interface - Top AC
Controller Exhaust - Top
Robot Blade Ceramic, narrow bridge
Buffer Transport - VHP+
Manual Lid Hoist - Yes
Helium Cooling IHC with MKS MFC (dual zone)
Host Interface - HSMS
Wafer Mapping
Water Leak Det. @ Gen. Rack/Controllers Alarm
EMO (Turn to release)
Gas Panel Enclosure - High purity, 5 RA, 1.125" surface mount
Facility - Bottom feed single line drop
Gas Panel Exhaust - Top exhaust
Chamber Gas Panel Control - O2 (Golden MFC)
Gas Stick - Full Stick
Filter Type - PALL
Turbo pump - Seiko Seiki STP-2503PV
Turbo controller - STP-A2503
Gate valve - Throttling type VAT 65 series
100m Torr manometer
RF source generator - 13.56MHZ 3.0KW APEX 3013
RF source match - Navigator 3013
RF bias generator - 13.56MHZ 1.5KW APEX 1513
RF bias match - Navigator match
Auto bias : Enabled
Cathode flow switches : Yes
Chamber wall return switch : Yes
Chamber cathode chiller : SMC POU INR-244-602A
Chamber wall chiller : SMC INR-498-012C
Endpoint type - Monochrometer (USB interface/chamber located)
BCL3 line heater - watlow anafaze controller
MFC Type - Unit DNET 8565 5RA
O2 - 1000sccm
BCL3 - 200sccm
CL2 - 200sccm
NF3 - 100sccm
HCL - 100sccm
Chamber details available upon request
De-installed and Palletized/Vacuum Packed Only
Shutdown Report Available
2000 vintage.
AMAT / APPLIED MATERIALS Centura AP is a multi-station, multi-chamber process reactor equipment designed for semiconductor processing. It provides an industry-leading 12-chamber layout for batch etch, deposition and wet clean processes. The system features a multilayer planar construction, allowing for a wide range of process options, from high-power, high-density plasma etch to low-pressure and high-temperature deposition. AMAT Centura AP is suitable for a variety of production applications, with an onboard process control unit ensuring maximum process control and reliability. Its process chamber builder configuration also allows for customized chamber architecture to best suit customer process requirements. For etch processes, APPLIED MATERIALS Centura AP is equipped with high-performance inductively-coupled plasma (ICP) etchers for precise and reliable control over etch profile and selectivity. The turbo-pumped process chambers have independent pressure and power control, allowing for the optimization of etch rates and etch uniformity. Etch products including non-etch materials, can also be processed on the machine. For deposition processes, Centura AP is equipped with robust and efficient deposition capabilities. The tool utilizes high-efficiency, high-throughput alloy (HEA) technology, enabling low-temperature, low-pressure deposition for a variety of thin films. AMAT / APPLIED MATERIALS Centura AP's integrated process control asset is designed for ease of use, maximum uptime and repeatable, precise results. The model provides an intuitive user interface and documentation, allowing operators to quickly get up to speed and ensure processes are optimized. The equipment's capabilities also support dynamic GUI based recipe loading, enabling quick and easy recipe to recipe transitions. The onboard diagnostics system on AMAT Centura AP allows for greater visibility into the overall process, helping to increase process uniformity and yield. The unit is equipped with an Advanced Process Control and Automatic Disturbance Monitoring (ACD/ADM) capability, which can quickly detect errors and incorrect settings and provide corrective action. APPLIED MATERIALS Centura AP is designed with an optional Advanced Adaptive-Feedback Control (AFB) feature to optimize the machine's performance and reliability. This feature allows the tool to proactively monitor and adjust for any changes in the process conditions, ensuring maximum repeatability and control. Overall, Centura AP is a flexible and reliable process reactor asset for a variety of production applications. Its robust features enable accurate and repeatable processes, allowing for reliable, consistent wafer formation and performance.
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